China Integrated Circuit Industry Investment Fund Co. Ltd., Advanced Micro-Fabrication Equipment Inc. (AMEC), And Suzhou Juyuan Dongfang Investment Fund (Limited Partnership) Invest in Piotech

ROHM Expands Its Full SiC Power Module Lineup

ISSI Wins Jury Verdict in Litigation Brought by GSI Technology

NXP Announces Final Regulatory Approval and Closing Date for Merger With Freescale

Samsung Starts Mass Producing Industry’s First 128-Gigabyte DDR4 Modules for Enterprise Servers

NXP Receives FTC Approval for Its Merger With Freescale

Anthony Dawson, VP ANSYS

SuperGuard Library Safety Qualification Suite - Solid Sands Solid Sands

Calista Redmond, CEO RISC-V

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

Sr. Silicon Design Engineer for AMD at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

CAD Engineer for Nvidia at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025