Oracle Announces General Availability of MySQL 5.7

Miami Design District's Palm Court a Winner in the USGBC 2015 LEEDership and Green Awards Program

Arup Celebrates Start of Construction for Phase 3 of MASS MoCA

Massive Mapping Show on the Facade of Gaudi's Masterpiece Casa Batlló Commemorates its 10th Anniversary as a Unesco World Heritage Site

Bentley Announces Project Finalists in 2015 Be Inspired Awards Program

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Firas Mohamed President IROC Technologies

Aaron Edwards, Senior Director Ansys Customer Excellence ANSYS

John Eble, VP Rambus

EDACafe Editorial by Roberto Frazzoli Shifting left software development; advancements in car power architectures; Japan’s semiconductor subsidies; ADI acquires Flex Logix

Siemens EDA by Romain Petit Multi-FPGA Partitioning – What’s the Recipe for Success?

Guest Blogger by Sanjay Gangal NVIDIA’s RISC-V Transformation: How Open Architecture Became Central to AI and Computing

The Dominion of Design by Sanjay Gangal Siemens’ Calibre 3DThermal: Pioneering Thermal Management in Next-Gen 3D-IC Design

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DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024

SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024

SEMI | MSIG MEMS & Imaging Sensors Summit at Munich Germany - Nov 14 - 15, 2024

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024