CartoPac and EDM Implement Transmission Line Inspection Software Solution for Western Area Power Administration

eXom ready for take-off - senseFly's intelligent mapping and inspection drone now available to pre-order

Trimble Introduces New Software Enhancements at Imaging and Geospatial Technology Forum

DigitalGlobe Produces the World’s First Complete and Consistent High Resolution Satellite Imagery Base Map of Africa

Visitor Registrations Flood In for GEO Business 2015

UN Outer Space Office provides open satellite resources for emergency response after Nepal earthquake

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Calista Redmond, CEO RISC-V

Firas Mohamed President IROC Technologies

EDACafe Editorial by Roberto Frazzoli Siemens-Altair deal; rumored OpenAI-Broadcom chip; 0.017 nm precision in chip stacking; transistors operating at 0.3 volts; Intel backstories

Guest Blogger by Sanjay Gangal NVIDIA’s RISC-V Transformation: How Open Architecture Became Central to AI and Computing

The Dominion of Design by Sanjay Gangal Siemens’ Calibre 3DThermal: Pioneering Thermal Management in Next-Gen 3D-IC Design

Bridging the Frontier by Bob Smith, Executive Director PDF Solutions’ John Kibarian on Bringing Semiconductor Manufacturing and Design Closer

EDACafe Editorial by Sanjay Gangal A New Era in RISC-V: SiFive’s HiFive Premier P550 Paves the Way for Software Innovation

Sr. Silicon Design Engineer for AMD at Santa Clara, California

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SEMICON Europa 2024 at Messe München München Germany - Nov 12 - 15, 2024

DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024

SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024

SEMI | MSIG MEMS & Imaging Sensors Summit at Munich Germany - Nov 14 - 15, 2024