Texas Instruments unveils a new STEM solution, the TI-Innovator™ Hub

Adeneo Embedded Announces the Development of Android Lollipop and Windows Embedded Compact 2013 for Sitara™ AM57x processors from Texas Instruments

Toshiba Introduces New Series of LDO Regulator ICs for Mobile Devices

Synopsys Galaxy Design Platform Enables 90 Percent of Volume-Production FinFET Designs

Synopsys Galaxy Design Platform Deployed by HiSilicon Technologies for Implementation of FinFET Designs

QuickLogic Expands Its SenseMe Software Library for Smartphone and Wearable Applications

Calista Redmond, CEO RISC-V

Firas Mohamed President IROC Technologies

Anthony Dawson, VP ANSYS

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

EDACafe Editorial by Sanjay Gangal NVIDIA and Industry Leaders Unveil Groundbreaking Real-Time Digital Twin Technology

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

GPU Design Verification Engineer for AMD at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

Sr. Silicon Design Engineer for AMD at Santa Clara, California

CAD Engineer for Nvidia at Santa Clara, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025