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Aaron Edwards, Senior Director Ansys Customer Excellence ANSYS

EDACafe Editorial by Roberto Frazzoli Siemens-Altair deal; rumored OpenAI-Broadcom chip; 0.017 nm precision in chip stacking; transistors operating at 0.3 volts; Intel backstories

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The Dominion of Design by Sanjay Gangal Siemens’ Calibre 3DThermal: Pioneering Thermal Management in Next-Gen 3D-IC Design

Bridging the Frontier by Bob Smith, Executive Director PDF Solutions’ John Kibarian on Bringing Semiconductor Manufacturing and Design Closer

EDACafe Editorial by Sanjay Gangal A New Era in RISC-V: SiFive’s HiFive Premier P550 Paves the Way for Software Innovation

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DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024

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