HP to Separate Into Two New Industry-Leading Public Companies

HP Expands Portfolio of Secure Printing Solutions for Enterprises

Canon Celebrates the 80th Anniversary of the Company’s First Camera – the Kwanon

Canon U.S.A. Expands Cloud-Connected Printer Line with Three PIXMA All-In-One Printer Models

TerraSky Inc. Forms a Relationship with Canon Information and Imaging Solutions, Inc., to Expand the Portfolio of Cloud-Based Offerings with Canon’s Forms and Print Services

Canon Broadcast Lenses, Digital SLR Cameras and Lenses Are Top Choice among Imaging Professionals Covering the Soccer Tournament in Brazil

Calista Redmond, CEO RISC-V

Andrew Baker , CEO Orca Semi

Arm, Exostellar Boost AI Cloud for Chip Design Exostellar

EDACafe Editorial by Roberto Frazzoli Rapidus advancements; automotive AI updates; CHIPS Act supporting SOI and SiC fabs; Qualcomm-Arm legal battle

Industry Predictions by Sanjay Gangal EDACafe Industry Predictions for 2025 – Point2 Technology

Siemens EDA by Juergen Jaeger FPGA-based prototyping – to build, or to buy, that is the question!

Guest Blogger by Sanjay Gangal Intel Foundry Unveils Breakthroughs in Transistor and Packaging Technologies at IEDM 2024

The Dominion of Design by Sanjay Gangal EDACafe Industry Predictions for 2025 – Semidynamics

Consumer Electronics Show 2025 - CES 2025 at Las Vegas Convention Center NV - Jan 7 - 10, 2025

ESD Alliance "Savage on Security” Webinar at United States - Jan 23, 2025

SEMICON Korea 2025 at Hall A, B, C, D, E, GrandBallroom, PLATZ, COEX, Seoul Korea (South) - Feb 19 - 21, 2025

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025