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Richardson Electronics Reports Second Quarter Fiscal 2014 Results and Declares Quarterly Cash Dividend

Fairchild Semiconductor’s 650 V Green Mode Buck Switches Offer the Highest Power Efficiency with System Design Scalability

Sigma Designs Announces New High-Performance SoCs for Smart TVs

Another Sidense Win Against Kilopass in the U.S. Court of Appeals for the Federal Circuit

Sonics Licenses On-Chip Network Technology To MediaTek

Ricky Lau, CTO The Six Semiconductor

Firas Mohamed President IROC Technologies

Andrew Baker , CEO Orca Semi

EDACafe Editorial by Roberto Frazzoli Shifting left software development; advancements in car power architectures; Japan’s semiconductor subsidies; ADI acquires Flex Logix

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

Siemens EDA by Romain Petit Multi-FPGA Partitioning – What’s the Recipe for Success?

Guest Blogger by Sanjay Gangal NVIDIA’s RISC-V Transformation: How Open Architecture Became Central to AI and Computing

The Dominion of Design by Sanjay Gangal Siemens’ Calibre 3DThermal: Pioneering Thermal Management in Next-Gen 3D-IC Design

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

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SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025