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Marvell ARMADA Mobile PXA1088 Quad-Core Communication Processor Powers New Samsung Smartphone

Avnet Electronics Marketing Introduces the I/O Carrier Card

Microsemi Announces PCI Express 2.0 SIG Certification for the Industry's Lowest Power SmartFusion2 SoC FPGAs and IGLOO2 FPGAs

Altera Releases New 100G Ethernet and Interlaken IP Cores To Drive High-Capacity Transmission and Backhaul Applications

Tokyo Electron Device Announces Release of TB-7VX-690T/-980T/-1140T-PCIEXP Development Test Platforms with Virtex-7 FPGA, Supporting Large-Scale PCI Express Gen3

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Ricky Lau, CTO The Six Semiconductor

EDACafe Editorial by Roberto Frazzoli Siemens-Altair deal; rumored OpenAI-Broadcom chip; 0.017 nm precision in chip stacking; transistors operating at 0.3 volts; Intel backstories

Guest Blogger by Sanjay Gangal NVIDIA’s RISC-V Transformation: How Open Architecture Became Central to AI and Computing

The Dominion of Design by Sanjay Gangal Siemens’ Calibre 3DThermal: Pioneering Thermal Management in Next-Gen 3D-IC Design

Bridging the Frontier by Bob Smith, Executive Director PDF Solutions’ John Kibarian on Bringing Semiconductor Manufacturing and Design Closer

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GPU Design Verification Engineer for AMD at Santa Clara, California

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SEMICON Europa 2024 at Messe München München Germany - Nov 12 - 15, 2024

DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024

SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024

SEMI | MSIG MEMS & Imaging Sensors Summit at Munich Germany - Nov 14 - 15, 2024