Intilop's enhanced Dual 10G NIC powered by their 76 ns TCP accelerator beats Solarflare 10G NIC delivering 4x higher throughput and 4x lower latency

New Ultra Low-power Internet of Things Kit for Smart Cities, Appliances

Altera Begins Production Shipments of FPGA Industry's Highest Performance SoCs

Avnet Electronics Marketing Helps Engineers Learn to Design Machines that See at the Embedded Vision Summit

New Spectra7 Chip Delivers Seamless Tablet to TV Connectivity

Cypress Updates Third-Quarter 2013 Guidance

Anthony Dawson, VP ANSYS

Firas Mohamed President IROC Technologies

Lou Ternullo, Senior Director of IP Product Management Rambus

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

EDACafe Editorial by Sanjay Gangal NVIDIA and Industry Leaders Unveil Groundbreaking Real-Time Digital Twin Technology

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

CAD Engineer for Nvidia at Santa Clara, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

Sr. Silicon Design Engineer for AMD at Santa Clara, California

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025