Themis Announces RES-XR4 Servers with Intel E5-2600 v2 Processors

New Intel CEO, President Outline Product Plans, Future of Computing Vision to ‘Mobilize’ Intel and Developers

Cypress Parallel nvSRAM Nonvolatile Memory Selected by LSI for Use in Industry’s First 12Gb/s SAS Host Bus Adapters

Mellanox End-to-End FDR 56Gb/s InfiniBand Solution Provides Leading Application Performance with the New Intel® Xeon® Processor E5-2600 v2 Product Family

Spirent Develops Advanced Testing Platform Based on Intel® Atom™ Processor C2000

IDT Announces Industry’s First 16-lane, 8 GT/s PCI Express 3.0 Signal-conditioning Retimer

Vincent Bligny, CEO Aniah

JB Baker, VP Products ScaleFlux

Ricky Lau, CTO The Six Semiconductor

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

EDACafe Editorial by Sanjay Gangal NVIDIA and Industry Leaders Unveil Groundbreaking Real-Time Digital Twin Technology

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

Sr. Silicon Design Engineer for AMD at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

GPU Design Verification Engineer for AMD at Santa Clara, California

CAD Engineer for Nvidia at Santa Clara, California

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025