MEDIA ALERT: Sidense Exhibiting and Presenting at TSMC Open Innovation Platform (OIP) Ecosystem Forum

MEDIA ALERT: Carbon Design Systems to Demonstrate System-Level Virtual Prototype Solutions, CPAKs for Pre-Silicon Software Development at Verify 2013

Si2 Announces Agenda and Speakers for 18th Si2 Conference

TSMC and OIP Ecosystem Partners Deliver 16FinFET and 3D IC Reference Flows

Cray Adds Large Memory and Shared Memory Solutions to Its Line of Cray CS300 Cluster Supercomputers

Atrenta Launches RTL Signoff Seminars in Asia

Simon Rance, Director of Product Management and Strategic Marketing Keysight Technologies

Andrew Baker , CEO Orca Semi

Josep Montanya , CEO Nanusens

EDACafe Editorial by Roberto Frazzoli Nvidia-powered CAE acceleration; new Keysight EDA software; CoWoS roadmap; new datacenter inference solution

Siemens EDA by Sanjay Gangal Enhance power reliability through design-stage layout optimization

Bridging the Frontier by Paul Cohen Honoring Dr. Jason Cong During the Phil Kaufman Award Ceremony and Banquet

Industry Predictions by Sanjay Gangal Intel’s New Xeon 6 SoC Redefines vRAN Efficiency, Single-Server Footprint for Cell Sites

EDACafe Editorial by Sanjay Gangal Siemens’ Innexis Suite Advances Shift Left for Faster, Earlier IC Development

Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California

Sr. Silicon Design Engineer for AMD at Santa Clara, California

GPU Design Verification Engineer for AMD at Santa Clara, California

Design Verification Engineer for Blockwork IT at Milpitas, California

CAD Engineer for Nvidia at Santa Clara, California

Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California

SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024

PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024

DVCon U.S. 2025 at United States - Feb 24 - 27, 2025

DATE 2025 - Design, Automation and Test in Europe Conference at France - Mar 31 - 2, 2025