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Marvell Delivers Custom Ethernet Network Interface Controller Solution at Open Compute Project
KIOXIA Introduces PCIe® 5.0 NVMe™ EDSFF E1.S SSDs for Cloud and Hyperscale Environments
Credo Announces PCI Express 6 /7, Compute Express Link CXL 3.x Retimers, and AEC PCI…
Advanced Energy’s New and Award-Winning Power Solutions for AI Servers at 2024 OCP Global Summit
Molex Explores Evolution of 48-Volt Systems in New Industry Report that Traces Major…
Navitas GaNSlim™ Power ICs Drive Ease-of-use, System Cost, and Energy Savings in Mobile,…
Configurable LED Matrix Driver and Touch Sensing Controller SoC
SEMIFIVE Extends Partnership with Arm to Advance AI and HPC SoC Platforms
ROHM at electronica 2024: Empowering Growth, Inspiring Innovation
Lattice Sentry Named a 2024 CyberSecurity Breakthrough Award Winner
AMD Unveils Leadership AI Solutions at Advancing AI 2024
AMD Launches 5th Gen AMD EPYC CPUs, Maintaining Leadership Performance and Features for the…
AMD Delivers Leadership AI Performance with AMD Instinct MI325X Accelerators
StreamUnlimited launched Stream210, a unique embedded hardware module, in partnership with…
Axiado and VVDN Technologies Collaborate to Showcase AI-Enhanced Platform Security and…
ScaleFlux accelerates innovation with expanded storage and memory technology portfolio
Silicon Labs and Kudelski IoT Partner to Accelerate Matter Device Certification
New Single Photon Detector on Silicon Photonics Platform Charts Path for Highly Integrated…
Alpha and Omega Semiconductor Announces Application-Specific EZBuck™ Regulator Designed…
MediaTek's Dimensity 9400 Flagship SoC Offers Extreme Performance and Efficiency for the…
ChipMOS REPORTS 8.7% YoY INCREASE IN 3Q24 REVENUE AND 1.2% YoY DECREASE IN SEPTEMBER 2024 REVENUE
ROHM’s New PWM Controller ICs with SOP Package for Power Supplies in a Wide Variety of…
Keysight Unveils 3kV High Voltage Wafer Test System for Power Semiconductors
Silicon Labs Series 3 Platform Guides the IoT Evolution
SensiML and Efabless Partner to Drive Open-Source Edge AI Innovation
Efabless Unveils New Custom Chip Platform Designed for Edge ML Products
Broadcom Delivers On AI Infrastructure Vision with Industry-Leading Solutions at 2024 OCP…
Terecircuits Unveils New Bonding Material for Next-Generation Advanced Packaging
Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
Astera Labs Introduces New Portfolio of Fabric Switches Purpose-Built for AI Infrastructure…
NVIDIA CEO Jensen Huang to Deliver CES 2025 Keynote
OMNIVISION’s New OX03H10 Image Sensor with TheiaCel™ Technology Brings Unparalleled…
Broadcom Announces Industry’s First Merchant Silicon 50G PON Solution with AI/ML Capabilities
GlobalFoundries Announces Conference Call to Review Third Quarter 2024 Financial Results
UMC Reports Sales for September 2024
SECO to Highlight Advanced COMPUTING Solutions powered by Qualcomm at Embedded World North America
Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona
AIM to Present on Ultra-Miniature Component Assembly at SMT-Info
Nano Dimension Announces Strong Preliminary Q3/2024 Results
LeddarTech Showcases LeddarVision at AutoSens Europe: AI-Driven Innovation Enhanced With TI…
Desktop Metal Stockholders Approve Merger with Nano Dimension
Untether AI Joins Forces with Ampere® to Provide Arm-based Energy Efficient AI Inference Solutions
RTX to develop ultra-wide bandgap semiconductors for DARPA
Keysight Expands Signal Generator Portfolio with New Portable, General-Purpose Solutions
QuickLogic Delivers eFPGA IP Targeting TSMC N12e™ Process in Record Time
MemryX Announces Production Availability of the MX3 Edge AI Accelerator
STMicroelectronics and Qualcomm enter strategic collaboration in wireless IoT
Clearlake and Francisco Partners Complete Acquisition of Black Duck Software, Formerly…
VR UniBlock Unveils Groundbreaking Low-Latency Wireless Chipset for Real-Time Applications
Sivers Semiconductors receives CHIPS Act funding award from NEMC Hub to Develop Full-Duplex…
GIGABYTE Unveils X870E/X870 Motherboards Specifically Designed for AMD Ryzen™ 9000…
UMC Collaborates with Ngee Ann Polytechnic to Strengthen Semiconductor Talent Pipeline
Lattice to Showcase Innovative AI Datacenter and Advanced Security Solutions at OCP Global Summit
SEMI Consortium to Develop Cybersecurity Strategy and Roadmap for the Semiconductor…
Unveiling the Industry’s First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC…
Sivers Semiconductors receives CHIPS Act funding award from NEMC Hub to Advance FR3…
NoMIS Power to Launch Advanced SiC MOSFETs at ICSCRM 2024
Alphawave Semi Wins Fifth Consecutive TSMC OIP Ecosystem Forum Partner of the Year Award
M31 Launches ONFi5.1 I/O IP on TSMC 5nm Process
ASUS IoT Introduces Arm-based Tinker Board 3 Single-Board Computer and Tinker System 3N for…
SK hynix Begins Volume Production of the World's First 12-Layer HBM3E
Micron Technology, Inc. Reports Results for the Fourth Quarter and Full Year of Fiscal 2024
Lorentz Solution jointly Presents with Nvidia on IC/3DIC with Distributed GPU-Accelerated…
Advanced Energy Launches High Power Density 1300 W, 28 V Half-Brick DC-DC Converter with…
Alpha and Omega Semiconductor Introduces an Ideal Diode Protection Switch with Limited…
Toshiba’s 1200V Additions to its Lineup of Third-Generation SiC Schottky Barrier Diodes…
Semtech and Traxmate Enable Precision IoT Asset Tracking
Camtek Introduced 5th Generation of the Eagle System Supporting Expected Growth In 2025
Renesas Leads ADAS Innovation with Power-Efficient 4th-Generation R-Car Automotive SoCs
Latest iteration of Microwave Switch Design Tool from Pickering Interfaces adds simulation…
Ceva and Edge Impulse Join Forces to Enable Faster, Easier Development of Edge AI Applications
Samsung Electronics Develops Industry’s First Automotive SSD Based on 8th-Generation V-NAND
Semtech Expands LoRaWAN® Reach in SMB and Smart Home
Broadcom Delivers Industry Leading 200G/lane DSP for Gen AI Infrastructure
Molex Unveils Versatile VaporConnect Optical Feedthrough Modules Enabling Thermal…
Semtech Accelerates 5G-Advanced Infrastructure Buildouts
Marvell to Showcase Optical Interconnect Innovations for Accelerated Infrastructure at ECOC 2024
ROHM’s New N-Channel MOSFETs Offer High Mounting Reliability in Automotive Applications
New Solution from Microchip Makes it Easier to Build Sophisticated Graphical User…
NewPhotonics Introduces NPG102 Transmitter-on-Chip for DSP-based Optical Modules Serving…
Keysight Unveils Optical Reference Transmitter to Validate Next-Generation Data Transmission
Arm and National Public Media Announce Custom Podcast Tech Unheard
Nano Labs Announces First Half of 2024 Financial Results
QuickLogic to Exhibit at GlobalFoundries Technology Summit in Munich
Valens Semiconductor Announces Three Automotive Design Wins from Leading European OEMs for…
Micron Expands SSD Portfolio With New Crucial P310 2280 Gen4 SSD, Bringing High-Octane…
Universal Pictures and Pixelworks Enter into Multi-year, Multi-Title Agreement for TrueCut…
Semtech Explores Scalable Analog Path For 6G Fronthaul at ECOC 2024
Lattice Semiconductor Appoints Ford Tamer as CEO
Mercury Introduces New Small Form Factor Digital Signal Processing Module Powered by Altera…
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