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ROHM’s New N-Channel MOSFETs Offer High Mounting Reliability in Automotive Applications
New Solution from Microchip Makes it Easier to Build Sophisticated Graphical User…
NewPhotonics Introduces NPG102 Transmitter-on-Chip for DSP-based Optical Modules Serving…
Keysight Unveils Optical Reference Transmitter to Validate Next-Generation Data Transmission
Arm and National Public Media Announce Custom Podcast Tech Unheard
Nano Labs Announces First Half of 2024 Financial Results
QuickLogic to Exhibit at GlobalFoundries Technology Summit in Munich
Valens Semiconductor Announces Three Automotive Design Wins from Leading European OEMs for…
Micron Expands SSD Portfolio With New Crucial P310 2280 Gen4 SSD, Bringing High-Octane…
Universal Pictures and Pixelworks Enter into Multi-year, Multi-Title Agreement for TrueCut…
Semtech Explores Scalable Analog Path For 6G Fronthaul at ECOC 2024
Lattice Semiconductor Appoints Ford Tamer as CEO
Mercury Introduces New Small Form Factor Digital Signal Processing Module Powered by Altera…
Samsung Begins Industry's First Mass Production of QLC 9th-Gen V-NAND for AI Era
Pasternack Launches Line of High-Frequency Connectors for Semi-Rigid Coax Cables
Semidynamics on major recruitment drive for RISC-V software engineers
MemryX to Showcase Edge AI Solutions at GSX 2024
Astera Labs Opens New R&D Hub in Bengaluru to Drive AI and Cloud Innovation
SK keyfoundry, Provides Solutions for Improved Mobile and Automotive Power Semiconductor…
SEGGER's experts offer new SEGGER Design Service to create cost-effective, high-performance…
MEMS & Imaging Sensors Summit to Highlight Innovations Driving the Next Generation of Connectivity
CELUS Collaborates with Renesas to Elevate Electronics Design Innovation
Automotive-Compliant, Hall Effect ICs from Diodes Incorporated Offer Wide Choice of…
Boston Semi Equipment Enters Magnetic MEMS Testing Market with Initial Order from Leading…
AMD Advancing AI 2024 Event to Highlight Next-gen Instinct and EPYC Processors and…
ChipMOS REPORTS 15.4% YoY GROWTH IN AUGUST 2024 REVENUE, UP 2.5% MoM
Tower Semiconductor Sets a New RFSOI Standard with Broadcom’s Wi-Fi RF Front-End Modules…
Advantest to Showcase IC Test Solutions at Inaugural SEMICON India, Sept. 11-13, 2024…
Faraday Unveils Advanced Packaging Coordinated Platform for Multi-Source Chiplets
intoPIX and BCnexxt Join Forces to Revolutionize Live Playout with JPEG XS Technology
Toshiba Starts Sample Shipments of Gate Driver IC for Automotive Brushed DC Motors that…
Media Alert: Rambus Hosting Expert Panel on AI Memory Requirements at the AI Hardware and…
Rambus Announces Industry-First HBM4 Controller IP to Accelerate Next-Generation AI Workloads
THine Announces the Industry-first Optical DSP-less 64Gbps PAM4 Chipset for PCIe6.0, Saving…
GlobalFoundries and Silicon Catalyst Partner to Accelerate Differentiated Technology…
Magnachip Expands Automotive Power Product Lineup with Four New 40V MXT MV MOSFETs
Broadcom Inc. Announces Third Quarter Fiscal Year 2024 Financial Results and Quarterly Dividend
ROHM and UAES Sign a Long-Term Supply Agreement for SiC Power Devices
TDK expands compact high-current choke series ERU33 toward higher currents with new core material
Ontech Introduces New High-Performance CEMF Sensor ASIC, Driving Innovation and Market…
SEGGER adds scope-like data visualization to SystemView
AIM to Present on Ultra-Miniature Assembly for Mini/MicroLEDs at MicroLED Connect
New Low-Frequency Waveguide Standard Gain Horns Are Tailored for Test and Measurement
Marvell, Lumentum and Coherent Demonstrate Industry's First 800G ZR/ZR+ Pluggable Modules…
UMC Reports Sales for August 2024
Navitas Qualifies Leading-edge Gen-3 Fast SiC to Auto-grade (Q101)
Electroninks Launches World-First Copper MOD Ink to Revolutionize Advanced Semiconductor Packaging
Silicon Labs' Bluetooth® Channel Sounding Provides Sub-Meter Accuracy to Drive Secure Fine Ranging
Kingston Brings Next-Gen Performance with NV3 PCIe 4.0 NVMe SSD
Toshiba Is Sampling an Automotive CXPI Responder Interface IC that Contributes to Shorter…
Sify becomes First in India to Achieve NVIDIA DGX-Ready Data Center Certification for…
ROHM's 4th Generation SiC MOSFET Bare Chips Adopted in Three EV Models of ZEEKR from Geely
Lattice to Showcase Latest FPGA Innovation at FPGA World Conference 2024
Finwave Semiconductor and GlobalFoundries Partner on RF GaN-on-Si Technology for Cellular…
12-Channel LED Driver from Diodes Incorporated Enables Superior Performance for Digital…
Efficient and GlobalFoundries Partner to Enable a New Category of Ultra Energy-Efficient,…
NVIDIA Announces Financial Results for Second Quarter Fiscal 2025
Accelerating AI with Essential Chips at GlobalFoundries Technology Summit 2024
CEVA Wins Prestigious OFweek China Automotive Industry Award 2024
Ambarella, Inc. Announces Second Quarter Fiscal Year 2025 Financial Results
Semtech Announces Second Quarter of Fiscal Year 2025 Results
Neurala Maintains Strong Revenue Growth of over 300% in H1 2024
NVIDIA and Global Partners Launch NIM Agent Blueprints for Enterprises to Make Their Own AI
Broadcom Innovations Accelerate Enterprise Edge AI Readiness
FuriosaAI Unveils RNGD, A Leading AI Inference Chip
ScaleFlux Powers the Future of Edge Computing: Efficiency Gains Amid Data Explosion
OMNIVISION Introduces 1/2.88-inch Small-Format 50-Megapixel Image Sensor with Video HDR for…
IPC Partners with Texas State University to Boost Workforce Development in Electronics Manufacturing
Qualcomm and Sequans Reach Agreement on Sale of 4G IoT Technology
DDN Co-Founder Alex Bouzari, AI and HPC Visionary, Joins NVIDIA's Co-Founder Jensen Huang…
Point2 Technology Joins Invite-Only Open Compute Project Startup Program
Fairview Microwave’s New Wi-Fi 6e/7 Omni and Flat-Panel Antennas Boost Modern Wireless Networking
Remcom to Provide NASA with Lunar Wireless Channel Simulation for LunaNet
Aetina Unveils ARM Platform Featuring AI Accelerators Tapping Into New Era of AI On ARM
Mobix Labs Announces Third Quarter 2024 Financial Results
Renesas Launches Ultra Compact Sensor Module for Smart Air Quality Monitoring at Homes,…
Alpha and Omega Semiconductor Expands Surface Mount Package Offering with New LFPAK 5x6…
Alphawave Semi CTO to Present Keynote on Connectivity for AI to Annual IEEE Hot…
10Gbps Automotive-Compliant Active Crossbar Mux from Diodes Incorporated Simplifies…
xMEMS Introduces 1mm-Thin Active Micro-Cooling “Fan on a Chip”
Nano Dimension Announces Q2/2024 and H1/2024 Results
Fujitsu Semiconductor Memory Solution Announces Change in Its Name to RAMXEED LIMITED
Mitsubishi Electric to Ship Samples of 200Gbps PIN-PD Chip for Both 800Gbps and 1.6Tbps…
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