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Last 30 days.
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SkyWater Announces Proposed CHIPS Funding to Enhance Domestic Semiconductor Production and Capabilities
Kudelski IoT and PUFsecurity Combine IoT Security Strengths to Meet the Challenges of…
Cirrus Logic Redefines Timing for Automotive Audio and Pro Audio Systems
Smartkem Signs Multi-Year Agreement with FlexiIC to Develop a New Generation of CMOS for…
Lumotive and Lattice Semiconductor to Demo Chip-Based Beam Steering for 3D Sensing at DevCon 2024
Navitas Showcases Breakthroughs in GaN and SiC Technologies for AI Data Centers, EVs, and…
MaxLinear Introduces High Performance Quad RS-485 Receivers with Superior ESD and EFT…
UMC Reports Sales for November 2024
Powering India's Energy Future: Silicon Labs ships four million chips with Wirepas for…
FPGA-Accelerated LLMs: The Future of AI Inferencing is Here
ROHM’s EcoSiC Technology Adopted in COSEL’s HFA/HCA Series 3.5kW Output AC-DC Power Supply Units
Semtech Announces Proposed Public Offering of Common Stock
GlobalFoundries GaN Chip Manufacturing Advances with $9.5 Million U.S. Federal Funding
Automotive-Compliant Current Shunt Monitors from Diodes Incorporated Enable High-Precision…
Axiado Raises $60M in Series C Funding to Boost AI Platform Security and Energy Efficiency
Advantech Unveils AMD Series to Boost Edge Cloud, Computing and Network Security!
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VSMC Celebrates Breaking Ground on 300mm Fab in Singapore
Alphawave Semi Joins UALink™ Consortium to Accelerate High-Speed AI Connections
Tachyum Runs AI Integer Matrix Operations on Prodigy FPGA Hardware
OFC 2025 Plenary to Spotlight Innovations in Photonics, Optical Communications and AI…
xMEMS Labs and Merry Electronics to Demo New 2-Way Over-the-Ear Headphone Reference Design…
Marvell Unveils Industry's First 3nm 1.6 Tbps PAM4 Interconnect Platform to Scale…
Silicon Labs' Breakthrough Ultra-Low Power Wi-Fi 6 and Bluetooth LE 5.4 Modules Supercharge…
SmartDV Licenses SDIO IP Family to RANiX for V2X Products
Microchip Technology Updates December 2024 Quarter Revenue Guidance, and Announces…
Fairview Microwave Launches Spring-Loaded Adapters for SMP, SMPM and SMPS Connectors
Polymatech Electronics Partners with South Wales SME 'SimplyRFMW' to Advance 5G and 6G RF…
TDK expands multilayer inductors for automotive Power-over-Coax circuits
Ambarella, Inc. Announces Third Quarter Fiscal Year 2025 Financial Results
Analog Devices Reports Fourth Quarter and Fiscal 2024 Financial Results
Renesas Extends Line-up For Industrial Ethernet and Multi-Axis Motor Control Solutions with…
Tower Semiconductor Releases 300mm Silicon Photonics Process as a Standard Foundry Offering
Semtech Announces Third Quarter of Fiscal Year 2025 Results
tinyVision.ai to showcase USB3 and edge vision technology at the Lattice Developers Conference 2024
Rocket Lab Signs $23.9M CHIPS Incentives Award to Boost Semiconductor Manufacturing
Nano Labs Launches Second-Generation V Series with 5x Power Efficiency Boost
Laser Photonics to Showcase Laser Solutions for Semiconductor Industry at IEEE…
Laimu Electronics Showcases Cutting-Edge Connector Solutions at Electronica 2024, Expanding…
Toshiba's Proposed Double-Transmon Coupler for Superconducting Quantum Computers Achieves…
Israeli Court Ruling Validates Nano Dimension Board’s Strategic Decisions and Clarifies…
eInfochips signs global distribution agreement for Infineon automotive software
SK hynix Starts Mass Production of World's First 321-High NAND
NVIDIA Announces Financial Results for Third Quarter Fiscal 2025
Molex Anticipates Steady Growth in High-Speed Connectivity in 2025, Driving Electronics…
Axis Communications Announces New ARTPEC-9 Chip Featuring Significant Enhancements for…
Nano Dimension Announces Q3/2024 Results – The Best 3rd Quarter in the Company’s History
GlobalFoundries and U.S. Department of Commerce Announce Award Agreement on CHIPS Act…
Renesas Introduces Industry’s First Complete Memory Interface Chipset Solutions for…
Quantum-Si Expands Collaboration with SkyWater to Develop New Chip Production Process…
Sony Semiconductor Solutions to Release an Industrial CMOS Image Sensor with Global Shutter…
Qualcomm Sets New Growth Targets, Showcasing Company’s Opportunity as On-Device AI…
ANAFLASH Secures New Funding to Advance Edge AI Processing and Innovation in Partnership…
xMEMS Introduces Sycamore, the World’s First 1-mm Thin Near-Field Full-Range MEMS Micro…
PI's New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times
Spectra7 and Keysight to Demonstrate Robust Performance Testing of 800Gbps Active Copper…
Ambiq and Edge Impulse Enable Low-Power Scalable AI
Samsung Reaches Key Milestone at New Semiconductor R&D Complex
Edgewater Wireless Joins Arm Flexible Access Program, Accelerating Innovation in…
indie Semiconductor Extends Automotive Photonics Leadership With Advanced Optical Component…
Tower Semiconductor Begins Production of 1.6Tbps Optical Transceivers on its Latest Silicon…
onsemi Hyperlux Sensors Selected for Subaru’s Next-Generation AI-Integrated EyeSight System
AIC and ScaleFlux Unveil New Storage Array Based on NVIDIA BlueField-3 DPU
NVIDIA Accelerates Google Quantum AI Processor Design With Simulation of Quantum Device Physics
AMD Accelerates Exascale Computing to New Heights Powering the Fastest Supercomputer Ever,…
Point2 Technology Announces Industry-Leading Smart Retimer Mixed-Signal SoC for 800G/1.6T…
Advantest Rolls Out Wave Scale RF20ex: High-Frequency, High-Bandwidth RF IC Test Card for…
InnoPhase IoT and Ingenic Launch AI-enabled Battery Powered Wi-Fi Camera Solution with 4K…
QuickLogic to Showcase Advanced eFPGA Hard IP Solutions at Space Tech Expo Europe 2024
Achronix to Showcase FPGA Acceleration for HPC at SuperComputing 2024
Applied Materials Announces Fourth Quarter and Fiscal Year 2024 Results
xMEMS Active Micro-Cooling “Fan on a Chip” Named as CES Innovation Awards® 2025 Honoree
GCT Semiconductor Holding, Inc. Reports Third Quarter 2024 Financial Results
Wise-integration Expands in North America With Ottawa Design Center to Develop Next-Gen…
CHERI Alliance Officially Launches, Adds Major Partners including Google, to Tackle…
High Fidelity Lossless Audio Headsets with integrated WiFi
L-com Launches Line of Diffuse Photoelectric Proximity Sensors
Durable New High-Frequency Connectors Fit 0.034 and 0.047 Semi-Rigid Coax Cables
Molex Announces Agreement to Acquire AirBorn, Expanding its Position in the Aerospace and…
Lightmatter and Amkor Technology Partner to Build World’s Largest 3D Photonics Package
Microchip to Accelerate Real-time Edge AI with NVIDIA Holoscan
New future-ready single-slot PXIe controller for high-performance T&M applications from…
Guerrilla RF Reports Third Quarter 2024 Results and Gross Margin Expansion
OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics…
Tower Semiconductor Reports 2024 Third Quarter Financial Results
MaxLinear and Quanta Cloud Technology Unveil Accelerated Software Defined Storage Solution…
Renesas Unveils Industry’s First Automotive Multi-Domain SoC Built with 3-nm Process Technology
Pixelworks Reports Third Quarter 2024 Financial Results
Skyworks Reports Q4 and Full Year FY24 Results
SECO AND RASPBERRY PI ENTER INTO A STRATEGIC PARTNERSHIP TO EXPAND THEIR INDUSTRIAL IOT OFFERINGS
InnoPhase IoT Collaborates With TDK InvenSense to Deliver Sustainable Sensor to Cloud IoT…
Tachyum Demonstrated Hardware Running AutoFDO Optimization Flow
Navitas and Richardson Electronics, Ltd. Expand Technology Partnership to EMEA for Next-Gen…
Edgewater Wireless Secures Backing of Renowned Incubator + Accelerator Silicon Catalyst
Achronix and BigCat Wireless Collaborate to Deliver Unprecedented Power Efficiency and…
Micron Introduces World’s Fastest, Most Energy Efficient 60TB SSD
AMD Announces Versal Premium Series Gen 2 Enabling New Levels of System Acceleration to…
Renesas Introduces New AnalogPAK Programmable Mixed-Signal ICs, Including First Low-Power…
InnoPhase IoT, GreenWaves Technologies and IDUN Audio Collaborate to Enable High Fidelity…
CAMTEK ANNOUNCES RESULTS FOR THE THIRD QUARTER OF 2024
GigaDevice Launches the GD32G5 Series High-Performance MCUs with Cortex®-M33 Core,…
GigaDevice Launches New EtherCAT® SubDevice Controller Chip, An Excellent Choice for…
intoPIX and Media Links: Powering Next-Generation IP Media Transport with JPEG XS at InterBEE 2024
ROHM's New 1200V IGBTs Achieve Industry-leading Low-loss Characteristics with High…
New high-speed, 20ps time-to-digital converter from ScioSense enables precise ranging…
NXP’s New i.MX 94 Family of Applications Processors Delivers Safe, Secure Connectivity…
ROHM’s New SiC Schottky Barrier Diodes for High-Voltage xEV Systems: Featuring a Unique…
QuickLogic Reports Financial Results for its Fiscal Third Quarter 2024
SEMIFIVE Collaborates with Synopsys to Develop Advanced Chiplet Platform for…
lowRISC and SCI Semiconductor Partner to Create First CHERIoT Commercial Tapeout
Renesas Jointly Developed World-Class “8-in-1” Proof of Concept with Nidec, Delivering…
onsemi Introduces the Industry’s Most Advanced Analog and Mixed-Signal Platform
ChipMOS REPORTS OCTOBER 2024 REVENUE
Arm Announces Appointment of Charlotte Eaton as Chief People Officer
ROHM’s New 1200V IGBTs Achieve Industry-Leading Low Loss Characteristics with High…
PDF Solutions® Reports Third Quarter 2024 Results
FormFactor and Advantest Partner on Silicon Photonics Wafer-Level Test Cell to Enable…
SkyWater Technology Reports Third Quarter 2024 Results
IonQ to Increase Performance and Scale of Quantum Computers with Photonic Integrated…
Motorola Solutions Reports Third-Quarter 2024 Financial Results
Diodes Incorporated Reports Third Quarter Fiscal 2024 Financial Results
Swift Navigation Collaborates with Sony Semiconductor Solutions to Enable Precise Location…
Alif Semiconductor Now Sampling World's First BLE and Matter Wireless Microcontroller to…
ISE Labs Investment Secures the Establishment of New Site for Semiconductor Packaging and…
MemryX Announces the Public Release of its Innovative Developer Hub 1.0
Infineon and Stellantis Team Up to Advance Innovation in Power Conversion and Distribution…
MACOM Reports Fiscal Fourth Quarter and Fiscal Year 2024 Financial Results
Ceva, Inc. Announces Third Quarter 2024 Financial Results
Forefront RF secures £16M to power next-gen connectivity solutions
Himax Technologies, Inc. Reports Third Quarter 2024 Financial Results; Provides Fourth…
ACM Research Reports Third Quarter 2024 Results
HTEC Acquires German end-to-end IoT solution provider eesy-innovation to Strengthen IoT,…
intoPIX JPEG XS Powers Village Island’s VICO-2L-XS for Cost-effective SDI/IP Conversion
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