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Interview with GP Singh, CEO, Ambient Scientific
Ansys to Release Fourth Quarter and FY 2024 Earnings on February 19, 2025
ZuriQ raises $4.2M to break quantum computing's scaling barrier
Synopsys to Hold Annual User Group Conference and Inaugural Executive Forum March 19-20 in…
VeriSilicon and Innobase Collaboratively Launched Second-Generation Yunbao Series 5G…
Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
Altair Engineering Inc. Stockholders Approve Proposed Merger with Siemens
MIPI Alliance Announces Board Leadership Appointments
MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA…
Teledyne Technologies Reports Fourth Quarter Results
Altium Acquires Part Analytics
Mouser Electronics Adds Over 60 Manufacturers in 2024, Continues to Expand Linecard for Customers
DVCon U.S. 2025 Announces Conference Program, Keynote Speakers & Panel Focused on…
Keysight Expands Chiplet Interconnect Standards Support in Chiplet PHY Designer 2025
CELUS and Blues Partner to Drive Next-Generation Electronic Design
Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
~ Planon Field Services will implement Total Experience strategy for Integrated Facility…
RIKEN adopts Siemens' emulation and High-Level Synthesis platforms for next-generation AI…
Silicon Photonics Pioneer CEA-Leti Will Unveil Major R&D Gains At Photonics West, Jan.…
EDACafe Industry Predictions for 2025 – Semidynamics
TSMC Reports Fourth Quarter EPS of NT$14.45
Alchip Opens 3DIC ASIC Design Services
Mouser Electronics New Product Insider: Over 10,000 New Parts Added in Fourth Quarter of 2024
Keysight Showcases Solutions Designed to Accelerate AI Innovation at DesignCon 2025
OIF to Showcase Advancements in Common Electrical I/O (CEI) Development and…
PFN, Rapidus and SAKURA internet Reach Basic Agreement toward Japan-Made AI Infrastructure…
Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
Silvaco Announces Preliminary Unaudited Fourth Quarter and Full-Year 2024 Results Ahead of…
MZ Technologies Unveils Next Generation Chiplet/Package Design Tool
Concisys Fully Integrated into XLR8 EMS
2025 Device Research Conference Announces Call for Papers
Exostiv Labs Unveils AMD Versal Adaptive SoC Device Support for Exostiv and Exostiv Blade Platforms
Synopsys Responds to the European Commission Approving its Proposed Acquisition of Ansys in Phase 1
TSMC December 2024 Revenue Report
NVIDIA Expands Omniverse With Generative Physical AI
Cadence Announces Fourth Quarter and Fiscal Year 2024 Financial Results Webcast
The PC Market Closed out 2024 with Slight Growth and Mixed Views on What 2025 Will Bring,…
RISC-V Breakthrough: SpacemiT Develops Server CPU Chip V100 for Next-Generation AI Applications
Morse Micro Introduces the Smallest, Fastest, Lowest Power and Farthest Reaching Wi-Fi Chip…
Cadence: Leading the EDA Industry with AI-Powered Platforms
Synopsys Responds to the UK Competition and Markets Authority Provisionally Accepting its…
Intel Accelerates Software-Defined Innovation with Whole-Vehicle Approach
Richardson Electronics Reports Second Quarter Results; Declares Quarterly Cash Dividend
GIGABYTE Unveils a diverse lineup of AI PCs with Groundbreaking GiMATE AI Agent at CES 2025
Lenovo™ at CES 2025: Pioneering the Future with AI-Powered Innovation for Business,…
Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports
VeriSilicon’s Display Processing IP DC8200-FS has Achieved ISO 26262 ASIL B Certification
Cirrus Logic Unveils Flexible Audio Solution for Intel Core Ultra Processors, Enabling…
Siemens launches new program to empower startups with cutting-edge technology
Siemens unveils breakthrough innovations in industrial AI and digital twin technology at CES 2025
Sony Exhibits at CES® 2025
STRADVISION Showcases Collaboration with Renesas at CES 2025
Ansys and Synopsys Announce Agreement with Keysight Technologies for Sale of Ansys PowerArtist
CES 2025: HP Unveils AI-Powered Experiences to Supercharge Productivity and Shape the Future of Work
AMD Announces Expanded Consumer and Commercial AI PC Portfolio at CES
EdgeRunner and Intel Partner to Deliver On-Device AI Agents to Intel AI PCs
Intel Extends Leadership in AI PCs and Edge Computing at CES 2025
Marvell Announces Breakthrough Co-Packaged Optics Architecture for Custom AI Accelerators
North American PCB Industry Sales Up 4.7 Percent in November
North American EMS Industry Up 10.6 Percent in November
Ansys to Demonstrate Solutions that Power Next-Generation Mobility Technology at CES 2025
Ignion is an exhibitor at CES 2025!
EMD Electronics Showcases Materials IntelligenceTM and Supports the Next Generation of…
Silvaco To Present at the 27th Annual Needham Growth Conference
Siemens extends Veloce hardware-assisted verification support of EPGM Ethernet to 1.6 Tbps
Incheon Shines Bright at CES 2025: 13 Innovation Awards won by Incheon Startups
Crypto Quantique adds TRNG to its quantum-derived, side-channel protected PUF hardware IP block
Ansys and Cognata Enable Robust ADAS/AV Sensor Testing on Microsoft Azure
MICROIP Debuts at CES 2025, Showcasing Rapid ASIC Design and AI Innovation
Weebit Nano licenses its ReRAM technology to onsemi
Nano Labs Launches FPU3.0 ASIC Design Architecture with 3D DRAM Stacking for AI and…
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