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Richardson Electronics Reports First Quarter Results; Declares Quarterly Cash Dividend
Pulsonix Version 13 Extends MCAD Integration with the IDX Collaboration Interface
Altair and Technical University of Munich Discover Breakthrough in Quantum Computing for…
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Driver Launches with $8M in Seed Funding Led by GV to Simplify Technical Documentation and…
LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to…
Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports
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Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024
TDK develops "spin-memristor" for neuromorphic devices, and collaborates with CEA and…
OIF to Demonstrate Industry Leadership in Interoperability at Network X 2024, 2024 OCP…
Qualcomm and Sequans Complete Sale of 4G IoT Technology
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Arm Accelerates AI From Cloud to Edge With New PyTorch and ExecuTorch Integrations to…
DVCon Europe Announces Program
A new level of application readiness - for increased efficiency and reliability
Qorvo® Introduces Next-Generation Matter™ Solution with Industry Leading Energy Efficiency
Preferred Networks Inc. adopts Siemens’ PowerPro software for next-generation AI chip design
Siemens collaborates with GlobalFoundries to certify Analog FastSPICE for the foundry’s…
Mouser to Exhibit and Empower Design Engineers at Debut of Embedded World North America 2024
IC Manage Extends GDP-XL Design and IP Management Leadership with 10x-100x Speedup, Rapid…
Altair Announces 2024-2025 Global Student Contest
OpenHW Group to Join the Eclipse Foundation, Expanding Open Source RISC-V Innovation
OKI to Exhibit High-Reliability Printed Circuit Boards for Aerospace, Defense, and…
Embracing the AI Era for a Win-Win Future of Memory Industry: The GMIF2024 Innovation…
Silvaco Appoints Candace Jackson as Senior Vice President, General Counsel, and Corporate Secretary
New CEA-Leti Technology Improves DC-DC Converter Efficiency and Paves the Way to…
MIPI Alliance Releases A-PHY v2.0, Doubling Maximum Data Rate of Automotive SerDes…
Liebherr, Ansys, and CADFEM Join Forces to Implement an Enterprise Simulation Strategy and…
Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next…
Interview with Colin Scholefield, Senior Director of Product Marketing, Boston Semi Equipment
TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows,…
Silicon Creations Awarded TSMC’s 2024 Open Innovation Platform Partner of the Year for…
Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design
OpsHub Announces OEM Partnership with Cadence for Verisium Manager Integration Support
Silvaco Expands its Victory TCAD and Digital Twin Modeling Platform to Planar CMOS, FinFET…
Intel Unveils Next-Generation AI Solutions with the Launch of Xeon 6 and Gaudi 3
TSMC Collaborates with Ansys and Microsoft to Accelerate Photonic Simulations
Samsung Electronics Develops Industry’s First Automotive SSD Based on 8th-Generation V-NAND
PC Refresh Cycle and Tablets in Emerging Markets Expected to Spur Demand in Coming…
TSMC August 2024 Revenue Report
Keysight Advances Software-Centric Solutions Strategy with Planned Acquisition of…
Interview with Tim Vehling, Executive Vice President of Global Sales, EdgeCortix
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OIF Unveils Three New CMIS Implementation Agreements – CMIS 5.3, ELSFP Pluggable CMIS,…
Sigmatron International, Inc. Reports First Quarter Financial Results For Fiscal 2025
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Joachim Kunkel Joins Arteris Board of Directors
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Keysight Introduces Quantum Circuit Simulation the First Circuit Environment with…
Intel and AWS Expand Strategic Collaboration, Helping Advance U.S.-Based Chip Manufacturing
Intel Awarded up to $3B by the Biden-Harris Administration for Secure Enclave
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Silvaco Announces Expected Addition to Three US Russell Indexes
SEALSQ Adopts RISC-V the Open-Standard RISC-V Architecture; Achievement Aligns with Rising…
MathWorks Announces Release 2024b of MATLAB and Simulink
Intel Names New Representative to Si2 Board
MEMS & Sensors Executive Congress 2024 to Highlight AI and Sensors Enabling New Applications
Daniel Cross of Cadence Wins Si2 Pinnacle Award
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New MathWorks Hardware Support Package Automates Code Generation From MATLAB and Simulink…
Mouser Electronics Explores Sustainable Smart Grid Innovation in Latest Content Series
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Synopsys Powers World's Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
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Colin Scholefield, Senior Director of Product Marketing
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Firas Mohamed President
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Arm, Exostellar Boost AI Cloud for Chip Design
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