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SEALSQ Adopts RISC-V the Open-Standard RISC-V Architecture; Achievement Aligns with Rising Global Demand for Edge-AI and Machine Learning Applications
MathWorks Announces Release 2024b of MATLAB and Simulink
Intel Names New Representative to Si2 Board
MEMS & Sensors Executive Congress 2024 to Highlight AI and Sensors Enabling New Applications
Daniel Cross of Cadence Wins Si2 Pinnacle Award
Sondrel announces Advanced Modelling Process for AI chip designs
Fairview Microwave Unveils RF Angled PCB Connectors in 1.85mm, 2.4mm and 2.92mm Sizes
Axiomise launches Essential Introduction to Practical Formal Verification Training
New MathWorks Hardware Support Package Automates Code Generation From MATLAB and Simulink…
Mouser Electronics Explores Sustainable Smart Grid Innovation in Latest Content Series
Arteris Interconnect IP Selected by VeriSilicon for High-Performance SoC Design
Synopsys Advances Imaging System Development with Industry's First Complete Virtual…
Synopsys Powers World's Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
Mobilint Debut New AI Chips at Silicon Valley Summit
SiMa.ai Expands ONE Platform for Edge AI with MLSoC™ Modalix, a New Product Family for…
Intel Launches Most Advanced Workstation Processor Family – Xeon W-3500 and W-2500
Intel and IBM Deliver Enterprise AI in the Cloud
SEMI Energy Collaborative Releases Recommendations for Growing the Supply of Low Carbon…
SiliconAuto adopts Siemens’ PAVE360 to accelerate pre-silicon ADAS SoC development
SEMICON® India 2024 to Highlight Local Semiconductor Ecosystem Growth and Industry Trends…
Lenovo Unveils Pioneering AI-Driven Devices at Lenovo Innovation World 2024
OIF Leads the Charge for Interoperability at ECOC 2024
Q2 2024 Global Semiconductor Equipment Billings Increased 4% Year-Over-Year, SEMI Reports
Altair Names Collaboration Betters the World as Channel Partner for the EMEA Region
Interview with John Eble, VP Product Marketing, Rambus
Altium 365 Apps Now Available in AWS Marketplace for Collaborative, Secure Design of…
North American EMS Industry Up 1.9 Percent in July
North American PCB Industry Sales Down 21.2 Percent in July
Altair Signs Collaboration Agreement with the Faculty of Data and Decisions Science at the…
Marvell Technology, Inc. Reports Second Quarter of Fiscal Year 2025 Financial Results
Accellera Unveils Portable Test and Stimulus Standard 3.0, Ushering in a New Era of…
Mouser Empowers Engineers with IIoT Technical Resources and Newest Industrial Products from Top Brands
HP Inc. Reports Fiscal 2024 Third Quarter Results
Keysight Unveils Wire Bond Inspection Solution for Semiconductor Manufacturing
OIF Concludes Successful Q3 ‘24 Technical and MA&E Committees Meeting with Launch of…
PQShield and Si-Five collaborate to advance post-quantum cryptography in RISC-V
Mouser Electronics' New Expansion Honored by IBCon as Most Intelligent DC-Powered Building and Largest Installation of PoE Lighting
Arm, Exostellar Boost AI Cloud for Chip Design: Interview with Tony Shakib, CEO, Exostellar
ESMC Breaks Ground on Dresden Fab
Pre-registration Now Open for NEPCON ASIA 2024: Experience the Future of Electronics Manufacturing
2025 IEEE Electronic Components and Technology Conference Announces Call for Papers
Authorized Distributor Mouser Electronics Offers Engineers the Latest Solutions from Arduino
Cadence Launches Fem.AI, Pledges $20M to Kickstart Gender Equity in the AI Workforce
New eBook from Mouser and Qorvo Explores Connectivity Needs and Technologies for Connected Homes
Interview with Josep Montanya , CEO, Nanusens
Synopsys Posts Financial Results for Third Quarter Fiscal Year 2024
DATE 2025 | Call for Papers
Keysight Technologies Reports Third Quarter 2024 Results
ADC IP - 14-Bit, 4.32 GSps Silicon-Proven: Now Available for Whitebox Licensing with No Royalty
DVCon U.S. 2025: Call for Tutorials and Workshops!
Global Semiconductor Manufacturing Industry Strengthens in Q2 2024, SEMI Reports
SEALSQ Introduces QS7001, a Newly Developed Cutting-Edge RISC-V Secure Hardware Platform,…
Electronics Industry Sentiment Rebounds in August After Three-Month Decline
SEMI Energy Collaborative Releases Analysis and Recommendations for Increasing Supply of…
New eBook from Mouser Electronics and Analog Devices Offers Insights into Design Challenges for Testing and Instrumentation
Lenovo Group: First Quarter Financial Results 2024/25
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40 Gbps UCIe IP; 300-mm GaN wafers; new edge AI SoCs; new US export controls
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Chip-level thermal analysis solves a main barrier to 3DICs
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