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Marvell Expands Strategic Collaboration with AWS to Enable Accelerated Infrastructure for AI in the Cloud
Intel Announces Retirement of CEO Pat Gelsinger
SEMI Publishes Recommendations for Semiconductor Policies in the 2024-2029 European…
Siemens’ Solido SPICE now certified for multiple leading-edge Samsung Foundry processes
Interview with john Kibarian, CEO, PDF Solutions
North American EMS Industry Up 14.7 Percent in October
GOWIN Semiconductor Introduces Educational EDA Version V1.9.10.03 with Mac OS Support
VeriSilicon Partners With LVGL to Enable Advanced GPU Acceleration for Wearable Devices and Beyond
sureCore now licensing its CryoMem range of IP for Quantum Computing
HighTec C/C++ Compiler Suite Supports Andes’ ISO 26262 Certified RISC-V IP for Automotive…
StratEdge Wins Prestigious IMAPS 2024 Corporate Recognition Award
HPC customer engages Sondrel for multi-million dollar, high end chip design
Valeo and ROHM Semiconductor Co-develop Next-generation Power Electronics
Dell Technologies Delivers Third Quarter Fiscal 2025 Financial Results
HP Inc. Reports Fiscal 2024 Full Year and Fourth Quarter Results
Interview with Vijay Chobisa, Senior Director Product Management, HAV, Siemens EDA
Intel and Biden-Harris Administration Finalize $7.86 Billion Funding Award Under US CHIPS Act
Andes Technology Collaborates with Lauterbach to Deliver RISC-V Trace Solution
Siemens unveils next generation AI-enhanced Electronic Systems Design software
NVIDIA and Industry Leaders Unveil Groundbreaking Real-Time Digital Twin Technology
Explore the Benefits of GaN-Based Power Electronics in the New eBook from Mouser Electronics, Analog Devices, and Bourns
Taichung Zero Waste Manufacturing Center Launches: A Milestone in Circular Economy and…
North American PCB Industry Sales Down 11.1 Percent in October
OIF Holds Q4 Technical and MA&E Committees Meetings in Melbourne, Australia—Announces…
Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
DVCon Europe Continues Growth with 50% increase in Research Papers
Global Semiconductor Manufacturing Industry Records Strong Growth in Q3 2024, SEMI Reports
Si2 ICMC 2025: Save the date/Call for Papers Announcement
Ansys Government Initiatives Selected to Join Microelectronics Commons to Support National Security
Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It…
Iontra Closes $45 Million Series C to Deliver Launch of the Industry's First Integrated…
Micross Reinforces US Electronics Supply Chain with Modernization of Near-Shored Hi-Rel…
NVIDIA Announces Omniverse Real-Time Physics Digital Twins With Industry Software Leaders
Keysight Technologies Reports Fourth Quarter and Fiscal Year 2024 Results
Experts Discuss the Future of Optical Modulators and Integrated Photonics in IEEE Journal…
Ansys to Drive Major Advances in AI-Powered Semiconductor Design Using NVIDIA AI
Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With…
MZ Technologies Updates Technology Roadmap
Rescale Enables Industry Softwares to Achieve Real-Time Engineering Simulations in the…
Ansys Accelerates CFD Simulation by 110x with NVIDIA GH200 Grace Hopper Superchips
Keysight Introduces Electronic Design Automation Software Suite Amplifying Designer…
Moreh, AI Software Startup partners with Tenstorrent, AI chip company to Challenge NVIDIA…
Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V…
Biden-Harris Administration Announces CHIPS Incentives Award with TSMC Arizona to Secure…
Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025
Lenovo Group: Second Quarter Financial Results 2024/25
Siemens’ Tessent In-System Test software enables advanced, deterministic testing…
First Annual SEMIEXPO Heartland Event to Assemble Leaders in Smart Manufacturing and Smart Mobility
Keysight Providing Software to Enable Researchers through the Microelectronics Commons
Vertiv Uses Ansys Digital Engineering Technology to Drive R&D Transformation
SIGNATURE OF A PARTNERSHIP AGREEMENT BETWEEN SECO AND NXP
Arrow Electronics Enhances Its ArrowSphere AI Capabilities to Boost Channel Partner Cloud…
Ayar Labs to Showcase the Future of AI Infrastructure with Fujitsu, Intel Foundry, Corning,…
MathWorks and NXP Unveil Model-Based Design Toolbox for Battery Management Systems
Silvaco Reports Third Quarter 2024 Financial Results
Call for Nominations: EDAA Awards at DATE 2025
Release of updated OSM Specification 1.2 and new Design Guide 1.1
Arteris and MIPS Partner on High-Performance RISC-V SoCs for Automotive, Datacenter and Edge AI
Mouser Explores the Open-Source Future with RISC-V Technology Resource Center
Worldwide Silicon Wafer Shipments Increase 6% in Q3 2024, SEMI Reports
Avalanche Technology Partners with Trusted Semiconductor Solutions to Develop Strategic…
Altair Signs Collaboration Agreement with the European Space Agency
LG AND TENSTORRENT EXPAND PARTNERSHIP TO ENHANCE AI CHIP CAPABILITIES
Keysight to Demonstrate Solutions Designed to Accelerate Innovation at electronica 2024
Siemens’ Calibre 3DThermal: Pioneering Thermal Management in Next-Gen 3D-IC Design
NVIDIA’s RISC-V Transformation: How Open Architecture Became Central to AI and Computing
TSMC October 2024 Revenue Report
Sondrel announces that it is opening up its library of IP for licensing
CEA-Leti to Present Research Breakthroughs in Non-Volatile Memory, RF and FDSOI, and Other…
Siemens extends Veloce hardware-assisted verification and validation with new Innexis…
Professors from Georgia Tech and University of Michigan to be Honored for Excellence in…
MIPS Releases P8700, Industry’s First High-Performance AI-Enabled RISC-V Automotive CPU…
Altair® PollEx™ for ECAD Now Available
Mouser Electronics Examines the Human-Centric Revolution of Industry 5.0
Interview with John Ferguson, Product Management Director, Calibre nmDRC, Siemens
M31 Launches USB4 IP for TSMC 5nm Process
Ansys Announces Q3 Financial Results
Ansys and IonQ Are Bringing the Power of Quantum to the $10 Billion Dollar Computer-Aided…
Arteris Announces Financial Results for the Third Quarter 2024 and Fourth Quarter and Full…
Tenstorrent Expands Deployment of Arteris’ Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions
European Chips Skills Academy Unveils Comprehensive Skills Strategy to Boost…
Keysight Announces Leadership Appointments
Astera Labs Announces Financial Results for the Third Quarter of Fiscal Year 2024
Teledyne to Acquire Micropac
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