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OIF Releases 800ZR Coherent Interface Implementation Agreement (IA) and Key 400ZR IA Updates, Addressing Market Demands for Scalable, Interoperable, High-Capacity Solutions
Siemens and CELUS Collaborate to Simplify AI-Powered PCB Design for SMBs
Synopsys Announces Earnings Release Date For Fourth Quarter and Fiscal Year 2024
Arteris Selected by TIER IV for Intelligent Vehicles
MIPI Alliance Releases Camera Security Specifications for Flexible End-to-End Protection of…
Perforce's Helix Core Now ISO 26262 Certified for Functional Safety in Automotive Development
North American EMS Industry Shipments Up 10.3 Percent in September
North American PCB Industry Shipments Down 24.1 Percent in September
New eBook from Mouser and Analog Devices Explores Power Efficiency and Robustness in Electronics Design
Cadence Reports Third Quarter 2024 Financial Results
Ausdia Joins TSMC Open Innovation Platform® (OIP) EDA Alliance
TSMC Recognizes Ansys for Excellence in Design Enablement for AI, HPC, and Photonics Silicon Systems
EDA start up Deneb Design launches performance modeling tool for AI-enabled System-on-Chips (SOC)
Silvaco Inc. Achieves ISO 9001 Certification for Comprehensive Suite of TCAD, EDA, and IP Products
Rogers Corporation Reports Third Quarter 2024 Results
Codasip enables secure Linux by donating CHERI RISC-V SDK to the CHERI Alliance
Renesas Collaborates with Intel on Best-in-Class Power Management Solution for New Intel…
Altium to Unveil Groundbreaking Industry Solution at Electronica 2024
Fractile licenses Andes Technology’s RISC-V vector processor as it builds radical new…
DeepComputing and Andes Technology Partner to Develop the World's First RISC-V AI PC with…
Arteris to Announce Financial Results for the Third Quarter 2024 on Tuesday, November 5, 2024
Interview with Phil Kaufman Award Winner Dr. Jason Cong, Professor, UCLA
Keysight Collaborates with Siemens EDA to Enable the Next Generation of Wireless Design
Andes Technology Unveils the D45-SE RISC-V Processor Targeting ASIL-D Certification
VeriSilicon’s DeWarp Processing IP DW200-FS Achieved ISO 26262 ASIL B Certification
SEMICON Japan 2024 to Expand Scope with Spotlight on Advanced Design Innovation
Arteris and SiFive Deliver Pre-verified Solution for the Datacenter Market
Arm Total Design Ignites Growing Ecosystem of Arm-based Silicon for a Sustainable AI Datacenter
eMemory Join Forces with Siemens on Groundbreaking SRAM Repair Toolset: Pre-integrated…
TSMC Reports Third Quarter EPS of NT$12.54
Codasip unveils versatile automotive-grade embedded RISC-V core
Ansys to Release Third Quarter 2024 Earnings on November 6, 2024
CEA-Leti Launches OpenTRNG, an Open-Source Project For True Random Number Generators Using…
AGC Launches the METEORWAVE® ELL Series of Ultra-Low Transmission Loss Multilayer PCB Materials
Arteris Network-on-Chip Tiling Innovation Accelerates Semiconductor Designs for AI Applications
Silvaco Announces Preliminary Unaudited Revenue for Q3 and Updates Full Year 2024
Intel and AMD Form x86 Ecosystem Advisory Group to Accelerate Innovation for Developers and…
MSI Showcases Innovation at 2024 OCP Global Summit, Highlighting DC-MHS, CXL Memory…
Cadence Announces Fem.AI Alliance to Lead Gender Equity Revolution in the AI Workforce
Easy-PC Celebrates 40 Years of Excellence in PCB Design with the Addition of Over 40 New Features
Micron Fuels New Wave of AI PCs With Launch of Ultra-Fast Clock Driver DDR5 Memory Portfolio
Altair Drives Aerospace Innovation at Motivo
Jabil Introduces New High-Performance, Purpose-Built AMD and Intel Servers Optimized for…
DisplayPort Rx PHY and Controller IP Cores in multiple Leading Technology Nodes for…
AMD Launches New Ryzen™ AI PRO 300 Series Processors to Power Next Generation of Commercial PCs
Interview with Adam Tilton, Co-founder and CEO, Driver
SEMIFIVE Concluded Mass Production Contract for AI Chip with HyperAccel
BOXX Elevates S-Class Workstations with New Intel® Core™ Ultra Processors
SensiML Expands Platform Support to Include the RISC-V Architecture
Altair Names Cimatron, part of Sandvik Group, as Global Channel Partner
Richardson Electronics Reports First Quarter Results; Declares Quarterly Cash Dividend
Pulsonix Version 13 Extends MCAD Integration with the IDX Collaboration Interface
Altair and Technical University of Munich Discover Breakthrough in Quantum Computing for…
MIPI Alliance Announces OEM, Expanded Ecosystem Support for MIPI A-PHY Automotive SerDes…
Mouser Electronics Unveils Dynamic New Circuit Showdown Competition Featuring Engineering Students in a Design Standoff
Mouser Electronics New Product Insider: Almost 7,000 New Parts Added in Third Quarter of 2024
Introducing ChipAgents: the World's First AI Agent for Chip Design and Verification
Driver Launches with $8M in Seed Funding Led by GV to Simplify Technical Documentation and…
LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to…
Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports
Crypto Quantique collaborates with ADLINK to simplify and enhance device security in industrial PCs
Cadence Announces Third Quarter 2024 Financial Results Webcast
Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024
TDK develops "spin-memristor" for neuromorphic devices, and collaborates with CEA and…
OIF to Demonstrate Industry Leadership in Interoperability at Network X 2024, 2024 OCP…
Qualcomm and Sequans Complete Sale of 4G IoT Technology
MacroFab Launches FabIQ to Revolutionize Electronics Manufacturing
Faraday Enhances 3D-IC Design Service with Ansys Multiphysics Analysis
Arm Accelerates AI From Cloud to Edge With New PyTorch and ExecuTorch Integrations to…
DVCon Europe Announces Program
A new level of application readiness - for increased efficiency and reliability
Qorvo® Introduces Next-Generation Matter™ Solution with Industry Leading Energy Efficiency
Preferred Networks Inc. adopts Siemens’ PowerPro software for next-generation AI chip design
Siemens collaborates with GlobalFoundries to certify Analog FastSPICE for the foundry’s…
Mouser to Exhibit and Empower Design Engineers at Debut of Embedded World North America 2024
IC Manage Extends GDP-XL Design and IP Management Leadership with 10x-100x Speedup, Rapid…
Altair Announces 2024-2025 Global Student Contest
OpenHW Group to Join the Eclipse Foundation, Expanding Open Source RISC-V Innovation
OKI to Exhibit High-Reliability Printed Circuit Boards for Aerospace, Defense, and…
Embracing the AI Era for a Win-Win Future of Memory Industry: The GMIF2024 Innovation…
Silvaco Appoints Candace Jackson as Senior Vice President, General Counsel, and Corporate Secretary
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Altair reportedly exploring a sale; AI architecture modeling; IBM demonstrates 21nm lines; limited effectiveness of U.S. export restrictions
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