Industry's First Sub-2mOhm MOSFET in a 3.3mm x 3.3mm Package

SAN JOSE, Calif. — (BUSINESS WIRE) — February 4, 2010 — Answering a critical design challenge in industrial, computing and telecommunications systems for higher efficiency and power density, Fairchild (NYSE: FCS) has launched a MOSFET family enabling thinner, lighter and more compact power supply solutions, while continuing to deliver high efficiency and excellent thermal enhancements.

The FDMC7570S, a 25V MOSFET, delivers the lowest R_DS(ON) in a 3mm x 3mm MLP package in the industry– providing unmatched efficiency and junction temperature improvements. With an R_DS(ON) of 1.6mOhm at 10V_GS (2.3mOhm 4.5V_GS), it delivers fifty percent lower conduction losses than alternate solutions in the same form factor – bringing designers the highest power density achievable today. All of these improvements are a direct result of Fairchild’s advanced proprietary PowerTrench® process technology, which yields an exceptionally low R_DS(ON), total gate charge (Q_G) and Miller Charge (Q_GD). As an added benefit, these MOSFETs feature a proprietary shielded gate architecture which reduces undesired high-frequency switching noise.

In addition, the output capacitance (C_OSS) and reverse recovery charge (Qrr) have been minimized to reduce synchronous MOSFET losses in a buck conversion – enhancements that result in high peak efficiencies, presently unmatched by lateral devices.

In addition to the 25V FDMC7570S, Fairchild’s new MOSFETs include the 30V FDMC7660S and the FDMC7660. These devices are available in the ultra-compact Power33, 3.3mm x 3.3mm MLP package. These MOSFETs are part of Fairchild’s extensive family of MOSFETs that offer compelling advantages in power designs.

Availability: Samples available now

Delivery: 8 weeks ARO