IRVINE, Calif., Oct. 14 /PRNewswire/ -- Toshiba America Electronic Components, Inc., (TAEC)* has added a diode with electrostatic discharge (ESD) protection and electromagnetic interference (EMI) filtering. The Toshiba DF3S6.8ECT protection diode provides digital and mobile equipment such as cell phones, PDAs, notebook PCs, digital cameras, and GPS devices with EMI and ESD protection from electrostatic discharge energy that is introduced from I/O ports and travels through the connectors onto the system boards.

The EMI/ESD diode features a high ESD protection level with clip voltage of 6.8V, and high ESD immunity level of +/-8kV (min.) @ IEC61000-4-2 (contact discharge). The Toshiba DF3S6.8ECT is offered in a small, thin three-pin CST3 package that measures 1.0mm x 0.6mm x 0.38mm.

"This EMI/ESD protection circuit does not cause signal distortion, and is suitable for applications such as high-speed digital circuits and high-frequency circuits," said Talayeh Saderi, business development engineer, RF and small signal devices, for TAEC.

    Characteristics
    Part Number                     DF3S6.8ECT
    Clip Voltage                    6.8V (typ.) @ I(R)=5mA
    Reverse Current                 0.5 microamperes (max.) @ V(R)=5V
    ESD Immunity Level              >/= +/-8kV@IEC61000-4-2(contact discharge)
    Absolute Attenuation            -20dB @ 0.8 to 2.0 GHz

Availability

The Toshiba DF3S6.8ECT ESD/EMI protection diode is available now.

Toshiba's Discrete Products

Since 1986, Toshiba Corp. has ranked as the top discrete supplier on a worldwide basis, based on annual revenue from international shipments of total discrete products. According to the most recent annual report from market research firm Gartner Dataquest (San Jose, CA), Toshiba remained the top discrete semiconductor supplier. (Source: "2008 Worldwide Semiconductor Market Share Report," Gartner, released April 2009). More specifically, Toshiba is a leading supplier in a number of discrete product categories, including power transistors, rectifiers and thyristors, LMOS logic, CMOS logic, photocouplers, Toslinks(TM), LEDs, small signal diodes and transistors. The company's discrete devices are designed to meet the growing demand for high-performance and lower voltages in today's wireless telecommunications and consumer electronics applications, while emphasizing its strength in the automotive and industrial markets.

*About TAEC and Toshiba Corp.

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributions and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2008 WW Semiconductor Market Share Report, April 2009). For additional company and product information, please visit http://www.toshiba.com/taec/.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at www.chips.toshiba.com, or from your TAEC representative.

LGSS 09 579

SOURCE Toshiba America Electronic Components, Inc.

Web site: http://www.toshiba.com/taec/