Toshiba Announces Space-Saving Dual Channel IC-Couplers

Surface Mount Optocouplers in S08 Packages Reduce Board Area by 40 Percent Compared to Single-Channel Devices

IRVINE, Calif., April 8 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, has expanded its IC photocoupler lineup with three dual-channel, totem-pole output devices housed in low profile S08 packages. Each of these devices, developed by Toshiba Corp. (Toshiba), reduce board area by approximately 40 percent per channel compared to single-channel devices in MFSOP6 packages to help reduce size and cost of multi-channel applications.

Two 5Mbps devices include the TLP2105, with buffer logic output, and the TLP2108, with inverter logic output. Applications for these photocouplers include insulated bus drivers, high speed line receivers, and system interfaces for microprocessors.

The 15Mbps TLP2166A features inverter logic output and a supply voltage of 3.3V, making it suitable for high speed, low-voltage applications such as interfaces for digital measurement and control equipment, insulated PC boards and various communication protocols.

Technical Specifications TLP2105

    Specification           Symbol           TLP2105               TLP2108

    Package                                 S08 5.1mm x         S08 5.1mm x
                                             3.95mm x             3.95mm x
                                              2.5mm                2.5mm

    Output type                          General purpose,     General purpose,
                                          buffer logic        inverter logic
                                          (totem-pole)        (totem-pole)

    Power supply voltage      V(CC)        4.5 to 20V            4.5 to 20V

    Input current logic       I(F)           1.6mA                  1.6mA
     high output (max.)

    Logic low output          V(OL)           0.6V                   0.6V
     voltage (max.)

    Propagation delay time   t(pHL)          250ns                  250ns
     (max.) (H to L)

    Propagation delay time   t(pLH)          250ns                  250ns
     (max.) (L to H)

    Operating temperature    T(opr)   -40 degrees C to       -40 degrees C to
     range                              +100 degrees C         +100 degrees C

    Common-mode transient    CMR          +/-10kV/us             +/-10kV/us
     immunity (min.)

    Isolation voltage        BV(S)         2500Vrms               2500Vrms
     (min.)

Technical Specifications TLP2166A

    Specification                   Symbol

    Package                                      S08 5.1mm x 3.95mm x 2.5mm

    Output type                               General purpose, inverter logic
                                                        (totem pole)

    Power supply voltage          V(CC)                  3.0 to 3.6V

    Input current logic high      I(FHL)                    3mA
     output (max.)

    Propagation delay time
     (max.) (H to L)              t(pHL)                   75ns

    Propagation delay time        t(pLH)                   75ns
     (max.)  (L to H)

    Operating temperature         T(opr)              -40 degrees C to
     range                                             +100 degrees C

    Common-mode transient         CMR                  +/-15 kV/us
     immunity (min.)

    Isolation voltage (min.)      BV(S)                  2500Vrms

Pricing and Availability

Samples of the Toshiba dual-channel photocouplers are available now. Prices for the 5Mbps TLP2105 and TLP2108 are $1.72 in quantities of 100. The TLP2166A is priced at $2.00 each in quantities of 100.

1 | 2  Next Page »
Featured Video
Editorial
More Editorial  
Jobs
Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California
Sr. Silicon Design Engineer for AMD at Santa Clara, California
GPU Design Verification Engineer for AMD at Santa Clara, California
Design Verification Engineer for Blockwork IT at Milpitas, California
Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California
CAD Engineer for Nvidia at Santa Clara, California
Upcoming Events
MEMS & Sensors Executive Congress (MSEC 2024) at Château-Bromont Hotel in Bromont Quebec Canada - Oct 7 - 9, 2024
PCB West 2024 at Santa Clara Convention Center Santa Clara CA - Oct 8 - 11, 2024
DVcon Europe 2024 at Holiday Inn Munich City Center, Munich Germany - Oct 15 - 16, 2024
International Test Conference (ITC) at United States - Nov 3 - 8, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise