CHICAGO - February 16, 2009 - The International Engineering Consortium (IEC) presented Dr. Rhines and Dr. Gargini with the esteemed Fellow Award preceding both of their respective keynote addresses live in front of hundreds of industry professionals at DesignCon 2009 in Santa Clara at the Santa Clara Convention Center.
"We're delighted to recognize the significant contributions both Dr. Rhines and Dr. Gargini continue to provide as visionaries in the electronic design engineering industry," commented IEC President John Janowiak. "We welcome each of them to the exemplary company of past Fellow Award winners."
The IEC's Board of Directors established the distinguished IEC Fellow Award in 1994 to recognize individuals who have provided the electronic design engineering and ICT industries with a superior level of sustained, significant service. Areas of service considered include education, technology and industry leadership contributions.
"I feel very privileged to have received the IEC Fellow Award and to be placed in the company of the many distinguished industry veterans who have previously been honored," said Walden C. Rhines, CEO and chairman, Mentor Graphics Corporation.
Prior to joining Mentor Graphics in October 1993, Dr. Rhines was executive vice president of the Texas Instruments (TI) Semiconductor Group, sharing responsibility for TI's component, consumer products and materials, and controls businesses. He was directly responsible for TI's worldwide semiconductor business. Dr. Rhines joined TI in 1972 and held a variety of technical and business management positions, primarily in the Semiconductor Group, but also in the Consumer Products division, Central Research Laboratories, and Data Systems group.
"I have spent most of my career improving my understanding of device physics and of process technology and I consider it a real honor to receive the Distinguished Fellow Award from the IEC," stated Dr. Paolo Gargini.
Dr. Gargini is the Director of Technology Strategy for Intel Corporation and is also responsible for world-wide research activities conducted outside Intel for the Technology and Manufacturing Group by consortia, institutes and universities. He has done research at LAMEL in Bologna, Stanford Electronics Laboratory, and Fairchild Camera and Instrument Research and Development in Palo Alto from 1970 to 1977. Since joining Intel in 1978, Dr. Gargini has conducted studies on Process Reliability; he was responsible for developing the building blocks of HMOS III and CHMOS III technologies used in the 1980's for the 80286 and the 80386 processors. In 1985 he headed the first submicron process development team at Intel. He also became an IEEE Fellow in 2008.
To view the Fellow Award presentations and respective keynotes and for more information please visit www.designcon.com/2009 or contact Katie Post at +1-312-559-3658 or Email Contact.
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About DesignCon 2009
Taking place annually in Silicon Valley, DesignCon serves as the premier event for practicing engineers in the electrical design and semiconductor communities. Broadening the scope to address business as well as technical issues in the industry, DesignCon 2009 will host more than 120 exhibiting companies and draw more than 5,000 industry professionals to register. This year, with more than 125 sessions and tutorials and more than 350 industry leaders to speak, DesignCon 2009 expects a record-breaking number of registrants. DesignCon 2009 will also premiere the IP Summit, a special featured program of the conference and exhibition. Visit
www.designcon.com/2009.
About the IEC
A nonprofit organization, the IEC is dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students.
In conjunction with industry-leading companies, the IEC has developed an extensive, free, on-line educational program. The IEC conducts industry-university programs that have a substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age.
More than 70 leading universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. Please visit www.iec.org.
