The advanced molding process used in the FCMBGA package underfills the flip chip die with molding compound providing both mechanical and electrical performance advantages. Mechanical advantages include:
- Larger die to package ratios that reduce package footprints providing improved printed wiring board utilization.
- Reduced package warpage for tighter coplanarity control which improves surface mount assembly.
- Improved package mechanical reliability by reducing material stresses.
- Additional mechanical support for heat sink attachment and multi die designs.
Electrical improvements include:
- Improved signal integrity for noise sensitive high speed signals through the placement of surface mounted passive devices (like decoupling capacitors) closer to the die.
- Reduced signal lengths and power distribution for challenging signal and power integrity requirements by enabling use of coreless or thin core substrates.
“Amkor developed this technology as a cost and performance enhancement to our industry leading SuperFC® package family. The molded structure improves coplanarity without requiring a stiffener, yet offers flexibility for lid attach in large package or high power applications,” said Miguel Jimarez, vice president of Advanced Process Development at Amkor.
About Amkor
Amkor Technology, Inc. (Nasdaq: AMKR) is a leading provider of semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings. Additional technical information on FCMBGA can be found on Amkor's web site: www.amkor.com.
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Amkor Technology, Inc.
Manager II, Marcom
Shellene Garner,
480-821-5000 ext. 5415
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