The demonstration features InterDigital's SlimChip Platform on an ExpressCard34(TM) form factor delivering true mobile broadband performance to a notebook computer with streaming video and file transfers at HSPA data rates of 7.2 Mbps downlink and 1.5 Mbps uplink. The exhibit further highlights:
-- SlimChip High Performance Baseband ICs
-- Slim modem architecture optimized for mobile broadband
devices
-- Advanced receiver technology and receive diversity for
superior cell-edge performance and interference mitigation
-- Power-efficient design using advanced battery saving
techniques
-- SlimChip Reference Platforms
-- Complete pre-certified chipsets, software and reference
designs for mobile broadband devices, such as ExpressCards, USB
sticks and mini cards for notebooks and UMPCs
-- Production tools for calibration, debug, software upgrades
-- Integration, verification, certification, and testing support
plus on-going maintenance program
-- SlimChip Modem IP that is proven in silicon
-- 2G and 3G physical layers
-- Dual mode protocol stack with InterRAT
-- Optimized integration of GSM/GPRS/EDGE/WCDMA/HSDPA/HSUPA
"Our family of SlimChip products addresses the diverse participants in the mobile market value chain, offering unique advantages to semiconductor companies and mobile device manufacturers," said Mark Lemmo, Executive Vice President, Business Development. "SlimChip solutions enable lower cost and faster time-to-market, increased network capacity, better coverage and faster data rates for a more satisfying consumer mobile broadband experience."
InterDigital invites members from the media and investment community and industry analysts to schedule personal meetings in advance by contacting jack.indekeu@interdigital.com.
About InterDigital
InterDigital designs, develops and provides advanced wireless technologies and products that drive voice and data communications. InterDigital is a leading contributor to the global wireless standards and holds a strong portfolio of patented technologies which it licenses to manufacturers of 2G, 2.5G, 3G, and 802 products worldwide. Additionally, the company offers a family of SlimChip(TM) high performance mobile broadband modem solutions, consisting of Baseband ICs, Modem IP and Reference Platforms. InterDigital's differentiated technology and product solutions deliver time-to-market, performance and cost benefits.
For more information, visit the InterDigital website: www.interdigital.com.
InterDigital and SlimChip are registered trademarks of InterDigital, Inc.
Contact:
InterDigital, Inc.
Media Contact:
Jack Indekeu,
+1-610-878-7800
Email:
Email Contact
or
Investor
Contact:
Janet Point, +1-610-878-7800
Email:
Email Contact
