Papers and panels will encompass the diverse issues surrounding re-usable IP, such as: IP development, purchasing, interconnect, verification and testing, IP quality, network on chip (NOC) and more.
Presentations will be given by many OCP-IP member companies including: CAST, CoWare, First Silicon Solutions, Jeda Technologies, Mentor Graphics, Nascentric, Nokia, OnDemand, Sonics, Summit Design, TransEDA, Yogitech, and many more. Panels will include: "It's physics, not logic: Raising abstraction back to the transistor," "Reviving Productivity with ESL and FPGA Platforms," "Competition vs. Partnership: Turning partnerships into improved business results" and others.
For more information on the OCP-IP DATE Pavilion see www.ocpip.org.
About OCP-IP
The OCP International Partnership Association, Inc. (OCP-IP), formed in 2001, promotes and supports the Open Core Protocol (OCP) as the complete socket standard ensuring rapid creation and integration of interoperable virtual components. OCP-IP's Governing Steering Committee participants include: Nokia (NYSE:NOK), Texas Instruments (NYSE:TXN), Toshiba Semiconductor Group (including Toshiba America TAEC), and Sonics. OCP-IP is a non-profit corporation delivering the first fully supported, openly licensed, core-centric protocol comprehensively fulfilling system-level integration requirements. The OCP facilitates IP core reusability and reduces design time, risk, and manufacturing costs for SoC designs. VSIA endorses the OCP socket, and OCP-IP is affiliated with the VSI Alliance. For additional background and membership information, visit www.OCPIP.org.
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Contact:
OCP-IP Ian Mackintosh, 650-938-2500 ext. 106 Email Contact or VitalCom Joe Basques, 650-366-8212 ext. 202 Email Contact
