The International Compact Modeling Conference Opens Registration
Register Now – Advanced Registration Ends June 24, 2025
SAN FRANCISCO, CALIFORNIA, USA – [MARCH 5, 2025] – Registration is now open for the International Compact Modeling Conference (ICMC) 2025, bringing together experts in device modeling to discuss advancements, innovations, and future directions in the field.
Join us June 26-27, 2025, at The Clift Royal Sonesta in San Francisco, CA, for this premier event. Take advantage of discounted rates by registering before June 24, 2025.
Secure Your Spot Today: https://2025.si2-icmc.org/registration/registration-information
Important Dates:
🔹 June 24, 2025: Advanced Registration Deadline (Discounted Rate)
🔹 June 26-27, 2025: International Compact Modeling Conference
About the International Compact Modeling Conference
The International Compact Modeling Conference is a new annual conference co-sponsored by the Silicon Integration Initiative Inc. (Si2), the Institute of Electrical and Electronics Engineers (IEEE), and the IEEE Electron Devices Society (EDS). Learn more at https://2025.si2-icmc.org/.
About Si2
The Silicon Integration Initiative Inc. is a not-for-profit, research, and development joint venture that (Si2) was founded in 1988 as the CAD Framework Initiative (CFI). Learn more at https://si2.org/.
About IEEE
IEEE is the world's largest technical professional organization dedicated to advancing technology for the benefit of humanity. Learn more at https://www.ieee.org/.
About IEEE EDS
EDS fosters the professional growth of its members by satisfying their needs for easy access to and exchange of technical information, publishing, education, and technical recognition and enhancing public visibility in the field of Electron Devices. Learn more at https://eds.ieee.org/.
Laura LeBlanc
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