Driving IoT and edge AI innovation at the inaugural event in Austin, Texas
Arezzo, Italy, 07 October 2024 – SECO, a leading global provider of end-to-end solutions for embedded computing, announced its participation in the inaugural embedded world North America in Austin, Texas, from October 8 to 10, 2024. This event follows SECO’s successful involvement at embedded world Shanghai in June and continues SECO’s long-standing tradition of partnering with the renowned Nuremberg-based exhibition, now expanding to the U.S.
Embedded world North America offers an invaluable opportunity for visitors to explore SECO’s solutions for the North American market, supported by the company’s U.S.-based engineering and operations. At booth #2315, SECO will display cutting-edge hardware and software technologies that reflect its commitment to innovation, pursued through strategic partnerships with leading technology providers. Last year, SECO was designated as a Qualcomm Technologies, Inc., IIoT design center partner, with the shared goal of advancing innovative edge computing products for the industrial IoT sector. This collaboration has fueled the development of advanced solutions based on the latest IoT processors from Qualcomm Technologies, which SECO is now pleased to present to the visitors of embedded world North America.
Product Spotlight
Following its official announcement at embedded world Nuremberg, SECO’s System on Modules (SOMs) based on Qualcomm® QCS6490 and Qualcomm® QCS5430 processors, will take center stage. The SOM-SMARC-QCS6490 is a ready-to-use computing module featuring the Qualcomm QCS6490 processor, a premium-tier platform tailored for industrial IoT, within a SMARC® 2.1.1 form-factor. This module is engineered for high performance and low power consumption, integrating the Qualcomm® Kryo™ 670 CPU and the Qualcomm® AI Engine for on-device machine learning applications.
At embedded world North America, SECO will feature a comprehensive development kit designed to expedite product development and software testing for IoT and edge AI applications. This versatile platform provides the necessary tools to exploit the performance and connectivity capabilities of the SOM-SMARC-QCS6490, offering an optimal environment for rapid prototyping and application development. The kit includes the SOM-SMARC-QCS6490 configured with 8GB LPDDR4 memory, 128GB UFS storage, and a Wi-Fi radio, paired with a 3.5” form-factor carrier board that supports a cellular modem via an mPCIe slot with a nano SIM holder, and a heatsink. The kit also includes an LCD display with a capacitive touch panelâ�‹, a debug cable, Wi-Fi antennaâ�‹, a boot/rescue SD card, an ethernet cableâ�‹, and a 12V power supply. For enhanced functionality, optional accessories such as MIPI-CSI cameras are also available.
The kit facilitates interconnected application development with Clea, SECO’s software suite for the Internet of Things. Working with any cloud provider and scalable from small to large widely distributed enterprise deployments, Clea easily enables device management features, remote over-the-air updates, complex data analysis on the SMARC itself, and communication to the cloud as needed.
Live Demo
The booth will also host a demonstration of SECO’s capabilities for edge AI development and deployment, utilizing a Qualcomm® application processor to run a Large Language Model (LLM) at the edge. The demo, which could be tailored for the medical field, illustrates the interaction with devices, efficient edge operation, and data privacy protection – even with limited computational resources.
“Through our collaboration with Qualcomm Technologies, we are pioneering advanced IoT and edge AI solutions, including the emergence of LLMs at the edge,” said Dario Freddi, Chief Strategy Officer of SECO. “We are excited to bring to market innovative and transformative technologies by combining SECO’s development expertise with Qualcomm Technologies industry leading technology and to showcasing our solution at embedded world North America 2024.”
“The incredible momentum we are seeing for Qualcomm IoT solutions is truly exciting. Together with SECO at embedded world North America, we will showcase the transformative potential of Gen AI at the edge.” said Sebastiano Di Filippo, Senior Director, Business Development at Qualcomm Europe, Inc. “The new SECO kit powered by the Qualcomm QCS6490 processor will help accelerate the development of high-performance, low-power devices and we are pleased to be working together to bring innovative Edge AI technologies to the industry.”
Discover how SECO’s technologies and solutions can advance your business by visiting booth #2315 at the Austin Convention Center on October 8 to 10. Meet our experts to discuss how SECO can help you integrate IoT and advanced AI capabilities into your products to foster new business opportunities.
