Faraday Unveils Advanced Packaging Coordinated Platform for Multi-Source Chiplets

HSINCHU, Taiwan — (BUSINESS WIRE) — September 10, 2024 — Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its advanced packaging coordinated platform for the vertical disintegration of chiplets. This unique platform streamlines the advanced packaging processes by integrating multiple vendors and multi-source chiplets and provides three core advanced packaging services - design, packaging, and production.

In today’s chiplet era, the advanced packaging capacity is increasingly limited. Faraday’s new platform addresses this challenge by effectively coordinating the vertically disintegrated vendors of chiplet, HBM, interposer, and 2.5D/3D packaging and offering chiplets design, testing analysis, production planning, outsourcing procurement, inventory management, as well as 2.5D/3D advanced packaging services. This platform provides a comprehensive one-stop solution with flexible services and business models tailored to the varied needs of clients. It ensures a consistent supply of critical components, including interposers and HBM, reflecting Faraday’s commitment to reliability, long-term supply, and business continuity.

In addition, Faraday excels in designing and implementing major chiplets, including I/O dies, SoC/Compute dies, and interposers. By partnering with UMC, Samsung, Intel, and various OSAT providers, Faraday delivers advanced packaging solutions containing system-level design, power and signal integrity analysis, and thermal dissipation optimization to support Intel’s EMIB, Samsung’s I-Cube, and 2.5D packaging in OSAT.

“Our new platform offers significant benefits to the industry,” said Flash Lin, COO of Faraday. “By leveraging our neutral position and delivering a comprehensive suite of services, we are well-positioned to drive innovation and improve project success in advanced packaging, ensuring superior results for our clients.”

About Faraday Technology Corporation

Faraday Technology Corporation (TWSE: 3035) is a leading ASIC design service and IP provider, certificated to ISO 9001 and ISO 26262. The broad silicon IP portfolio includes I/O, Cell Library, Memory Compiler, ARM-compliant CPUs, LPDDR4/4X, DDR4/3, MIPI D-PHY, V-by-One, USB 3.1/2.0, 10/100 Ethernet, Giga Ethernet, SATA3/2, PCIe Gen4/3, and 28G programmable SerDes, etc. Headquartered in Taiwan, Faraday has service and support offices around the world, including the U.S., Japan, and China. For more information, visit www.faraday-tech.com or follow Faraday on LinkedIn.



Contact:

Press:
Faraday Tech, Evan Ke, +886 3 578 7888 ext. 88689, media@faraday-tech.com

Featured Video
Jobs
Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California
GPU Design Verification Engineer for AMD at Santa Clara, California
CAD Engineer for Nvidia at Santa Clara, California
Design Verification Engineer for Blockwork IT at Milpitas, California
Electrical Engineer for California Water Service Group at San Jose, California
Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California
Upcoming Events
DVcon Europe 2024 at Holiday Inn Munich City Center, Munich Germany - Oct 15 - 16, 2024
International Test Conference (ITC) at United States - Nov 3 - 8, 2024
Phil Kaufman Award Ceremony and Banquet to be held November 6 at Hayes Mansion at Hayes Mansion 200 Edenvale Ave San Jose CA - Nov 6, 2024
SEMI | MSIG MEMS & Imaging Sensors Summit at Munich Germany - Nov 14 - 15, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise