April 9-11 event in Nuremberg, Germany, to include 12 MIPI-related presentations
PISCATAWAY, N.J. — (BUSINESS WIRE) — February 29, 2024 — The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced that the 22nd embedded world Exhibition & Conference, scheduled for April 9-11 in Nuremberg, Germany, will include a dozen presentations showcasing MIPI specifications, including three dedicated education tracks focused on MIPI camera and display specifications, MIPI in automotive, and the MIPI I3C utility and control bus.
The event covers all aspects of the development and application of embedded systems, from fundamental technologies to development processes and special fields of applications. MIPI Alliance is again serving as a Community Partner for the event, and members can register for the conference using the code “EWC24MIPI” to receive a 10% discount.
WHAT: Embedded World
Exhibition & Conference
WHEN: April 9-11, 2024
WHERE: Nuremberg, Germany
WHO SHOULD ATTEND: Engineers and technical management working along the intersection of applied research and industrial applications of embedded systems.
MIPI CONFERENCE TRACKS:
The embedded world program includes nine MIPI-powered presentations within three Board Level Hardware Engineering tracks that will highlight MIPI I3C, MIPI Camera Serial Interface 2 ( CSI-2), MIPI Display Serial Interface ( DSI) and MIPI A-PHY. Three more MIPI member presentations will be featured within other sessions over the three-day event.
MIPI I3C Track - powered by MIPI
Session 5.4 Board Level Hardware Engineering
10 April | 11:00-12:45
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MIPI I3C, The Next-Generation Utility and Control Bus Supporting Time-Critical Applications
Michele Scarlatella (MIPI Alliance)
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Demystifying I3C Protocol
Martin Cavallo (Binho)
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Demonstrating the Benefits of I3C Through Real World Implementations
Lars Häring (Microchip Technology)
MIPI Track - powered by MIPI
Session 5.5 Board Level Hardware Engineering
10 April | 13:45-15:30
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Challenges and Solution Supporting HiRes 13+ MP Camera Sensors within MIPI D-PHY Domain
Mark Hoopes (Lattice Semiconductor)
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A MIPI DSI/CSI-2/D-PHY Deep Dive
Ali Osman Ors (NXP Semiconductors)
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MIPI CSI-2 - Enabling Machine Vision in Industrial Applications
Ariel Lasry (Qualcomm), Vice Chair of the A-PHY Working Group
Automotive Design Track
Session 5.10 Board Level Hardware Engineering
11 April | 09:30-11:15
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MIPI A-PHY Camera Ingestion for Automotive x86 Architectures
Frederik John and Dr. Stephanie Friederich (Intel Deutschland)
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Connecting the Automotive Future: A Harsh Environment for Moving Bits
Dr. Julien Henaut (BitifEye Test Solutions) and Eyran Lida (Valens Semiconductor)
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MIPI A-PHY v2.0 Automotive SerDes Interface - Supporting Software-Defined Vehicles and Next-Generation Centralized Automotive E/E Architectures
Edo Cohen (Valens Semiconductor), Co-Chair of the MIPI A-PHY Working Group
MORE MIPI MEMBER PRESENTATIONS:
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How Can Connectivity Innovations Transform Machine Vision Applications in the Industrial Market?
Yaki Sfadya (Valens Semiconductor)
Session 7.3 Standards - Embedded Vision and Edge AI Standards
9 April | 16:00 - 16:30
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Centralizing Radar Processing with High-Speed Connectivity
Edo Cohen (Valens Semiconductor)
Session 2.12 Wireless 2 - Connectivity Solutions
11 April | 15:00 - 15:30
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Reducing the Microcontroller Pin Count by Utilizing its I3C Interface for Debugging
Ingo Rohloff (Lauterbach)
Session 6.12 Debugging - Systems & Software Engineering
11 April | 15:30 - 16:00
Detailed descriptions of these sessions can be found at MIPI Events.
See the full agenda: embedded world Conference Program.
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About MIPI Alliance
MIPI Alliance (MIPI) develops interface specifications for mobile and mobile-influenced industries. There is at least one MIPI specification in every smartphone manufactured today. The organization has over 375 member companies worldwide and more than 15 active working groups delivering specifications within the extended mobile ecosystem. Members of the organization include handset manufacturers, device OEMs, software providers, semiconductor companies, application processor developers, IP tool providers, automotive OEMs and Tier 1 suppliers, and test and test equipment companies, as well as camera, tablet and laptop manufacturers. For more information, please visit www.mipi.org.
MIPI®, A-PHY®, CSI-2®, DSI® and I3C® are registered trademarks owned by MIPI Alliance. D-PHY�nbsp; is a service mark of MIPI Alliance.
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Contact:
Becky Obbema
Interprose for MIPI Alliance
+1 408.569.3546
becky.obbema@interprosepr.com