Solderstar, a global leader in temperature profiling equipment for soldering processes, is gearing up to make a significant impact at Productronica 2023 in Munich from November 14th to 17th. Solderstar will unveil its innovative new product, the Reflow Shuttle O2 measurement module, promising to redefine how the electronics industry approaches reflow process verification.
The Reflow Shuttle O2 measurement module represents a major leap forward in the quest for precise reflow soldering control. Oxygen (O2) measurement is crucial because it can affect the solder joint quality. It can react with the solder to form oxides, weakening the joint and making it more susceptible to failure. Additionally, O2 can cause the solder de-wetting, preventing a good bond with the PCB.