Toshiba Launches Small Photorelay Suitable for High-Frequency Signal Switches in Semiconductor Testers

- Reduced Insertion Loss and Improved High-Frequency Signal Transmission Characteristics -

KAWASAKI, Japan — (BUSINESS WIRE) — October 16, 2023Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched " TLP3475W," a photorelay in a small, thin WSON4 package. It reduces insertion loss and suppresses power attenuation in high-frequency signals [1] and is suitable for the pin electronics of semiconductor testers, which use a large number of relays and require high-speed signaling. Volume shipments start today.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20231016925097/en/

Toshiba: TLP3475W, a photorelay in a small, thin WSON4 package. (Graphic: Business Wire)

Toshiba: TLP3475W, a photorelay in a small, thin WSON4 package. (Graphic: Business Wire)

Toshiba’s optimized package designs reduces parasitic capacitance and inductance in the new photorelay. This reduces insertion loss and improves the transmission characteristic of high-frequency signals to 20GHz (typ.) [2], about 1.5 times lower [2] than Toshiba’s current product, TLP3475S.

TLP3475W uses a small, thin WSON4 package that is only 0.8mm (typ.) thick, making it the smallest [3] photorelay in the industry to realize improved high-frequency signal transmission characteristics. It is 40% lower in height than Toshiba’s ultra-small S-VSON4T package, allowing more products to be mounted on the same circuit board, and will contribute to improved measuring efficiency.

Toshiba will continue to expand its product line-up to support semiconductor testers that deliver higher speeds and greater functionality.

Applications

  • Semiconductor testers (high-speed memory testers, high-speed logic testers, etc.)
  • Probe cards
  • Measuring equipment

Features

  • Industry’s smallest [3] WSON4 package: 1.45mm×2.0mm (typ.), t=0.8mm (typ.)
  • Improving to pass the high-frequency signals : f=20GHz (typ.) @Insertion loss(S21) = -3dB
  • Normally open function (1-Form-A)

Notes:

[1] When the frequency band is in the range of several hundreds of megahertz to several tens of gigahertz.
[2] The frequency band where the power attenuation ratio (insertion loss) when the signal passes through the output MOSFET is -3dB.
[3] For photorelays. As of October 2023, Toshiba survey.

Main Specifications

(Unless otherwise specified, Ta = 25°C)

Part Number

TLP3475W

Package

Name

WSON4

Size (mm)

1.45×2.0 (typ.), t=0.8 (typ.)

Absolute maximum ratings

OFF-state output terminal voltage VOFF (V)

60

ON-state current ION (A)

0.4

ON-state current (pulsed) IONP (A)

1.2

Operating temperature Topr (°C)

-40 to 110

Coupled electrical characteristics

Trigger LED current IFT (mA)

max

3.0

ON-state resistance RON (Ω)

typ.

1.1

max

1.5

Electrical characteristics

Output capacitance COFF (pF)

max

20

Switching characteristics

Turn-on time tON (ms)

@RL = 200Ω,

VDD = 20V,

IF = 5mA

max

0.25

Turn-off time tOFF (ms)

0.2

Isolation characteristics

Isolation voltage BVS (Vrms)

min

300

Sample Check & Availability

Buy Online

Follow the link below for more on the new product.
TLP3475W

Follow the link below for more on Toshiba’s photorelays.
Photorelays (MOSFET Output)

1 | 2  Next Page »
Featured Video
Jobs
Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California
Sr. Silicon Design Engineer for AMD at Santa Clara, California
GPU Design Verification Engineer for AMD at Santa Clara, California
Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California
Design Verification Engineer for Blockwork IT at Milpitas, California
CAD Engineer for Nvidia at Santa Clara, California
Upcoming Events
Phil Kaufman Award Ceremony and Banquet to be held November 6 at Hayes Mansion at Hayes Mansion 200 Edenvale Ave San Jose CA - Nov 6, 2024
SEMICON Europa 2024 at Messe München München Germany - Nov 12 - 15, 2024
DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024
SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise