SEOUL, Korea — August 29, 2023 — With advanced packaging a key enabler of semiconductor innovation, the stage is set for the Advanced Packaging Summit as industry leaders and visionaries gather September 5 at the Suwon Convention Center for insights into critical themes including advances in high-performance computing (HPC). Registration is open.
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Representatives from chip manufacturing powerhouses such as AMD, Samsung Electronics and SK hynix will join leading packaging providers and research institutions to present on topics including HPC interconnection technologies, 3D packaging, chiplets, HIR (Heterogeneous Integration Roadmap), Hybrid Bonding, LAB (Laser Assisted Bonding), and supply chain management during two sessions.
Session 1: High-Performance Computing
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Wu Xin, Corporate Vice President, Silicon Technology
AMD |
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Ki Ill Moon, Vice President, Head of Packaging Technology Development
SK hynix |
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Stefan Chitoraga, Technology and Market Analyst, Packaging and Assembly
Yole Group |
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Session 2: Interconnection Technology for High-Performance Computing
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Jongsoo Choi, Principal Professional
Samsung Electronics |
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Vikas Dubey, Senior Scientist Systems Packaging
Fraunhofer ENAS |
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Dongshun Bai, Senior Technologist and Business Development Director
Brewer Science |
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SeokHo Na , Master, Sr. Director of R&D
Amkor Technology Korea |
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