SEMICON Taiwan 2023 to Highlight Auto Chips, Advanced Manufacturing, Sustainability, Cybersecurity, Talent

HSINCHU, Taiwan – August 1, 2023 – With Taiwan forecast to remain a top buyer of chipmaking equipment, the stage is set for SEMICON Taiwan 2023 as companies from across the electronics design and manufacturing supply chain gather for insights into the latest trends, developments and innovations driving industry growth. Registration is open for the exhibition and conferences, September 6-8, 2023, at TaiNEX 1 and 2 in Taipei.

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The largest SEMICON Taiwan ever, the event is expected to draw more than 50,000 attendees while featuring 3,000 booths and 850 exhibitors. Themed Inspire Innovation. Empower Sustainability, SEMICON Taiwan 2023 will offer more than 20 forums spotlighting critical semiconductor industry topics including:

  • Advanced Manufacturing
  • Heterogeneous Integration
  • Compound Semiconductors
  • Automotive Chips
  • Smart Manufacturing
  • Sustainable Manufacturing
  • Semiconductor Cybersecurity
  • Talent

Taiwan is projected to maintain a top position in purchases of chipmaking equipment in 2023 and 2024, according to the recent Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective announced by SEMI.

“The semiconductor industry is the main driving force for technology development and critical to innovations that promise to help overcome some of the world’s greatest challenges,” said Terry Tsao, Global Chief Marketing Officer at SEMI and President of SEMI Taiwan. “SEMICON Taiwan 2023 will bring together representatives from the global microelectronics industry, governments, academia and research to set a path to a more prosperous, sustainable future.”

SEMICON Taiwan 2023 Highlights

CEO Summit
Top semiconductor industry executives will gather at the CEO Summit to examine vital innovation trends and keys to the industry’s success over the next 20 years. Featured speakers will include:

  • Tien Wu, CEO of Advanced Semiconductor Engineering (ASE)
  • Mark Liu, Chairman of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC)
  • Anirudh Devgan, President and CEO of Cadence Design Systems
  • Tim Archer, President and CEO of Lam Research
  • Toshiki Kawai, President and CEO of Tokyo Electron (TEL)

Market and Industry Trend Forum
Top industry analysts will explore market trends, present industry forecasts and provide insights into how companies across the semiconductor ecosystems can navigate the unpredictable market environment. Speakers will include analysts from Gartner, McKinsey & Company, Morgan Stanley, Mizuho Bank, the SEMI Market Intelligent Team (MIT), and TechInsights

8 Country Pavilions
With Taiwan a vital and reliable partner in the global economy, many regions have sought cooperation with the region in order to better adapt to a rapidly changing industry. Toward that end, SEMICON Taiwan 2023 will feature eight country pavilions including Australia, the Czech Republic, the UK, Italy, Japan, Poland and Singapore. In addition, the Silicon Europe Pavilion will feature Dutch and German exhibitors.

12 Theme Pavilions and Multiple International Forums
SEMICON Taiwan 2023 will feature 12 theme pavilions to showcase areas key to semiconductor industry growth including Heterogeneous Integration, Compound Semiconductor, Materials, Green Manufacturing, and Workforce Development.

The event will also host Smart Manufacturing Journey, themed AI-Driven Innovation of Future Automation. The interactive exhibition of virtual and real integration technology will showcase powerful, innovative artificial intelligence (AI) technologies and the latest developments in robotics and automation.

SEMICON 2023 will also include:

Register for SEMICON Taiwan 2023 before August 15 for a 25% early-bird discount. Groups of more than three people receive a 50% early-bird discount.

Register for International Forums by August 15 for an early-bird discount of up to 50%. 
 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit  www.semi.org, contact one of our worldwide offices, and connect with SEMI on  LinkedIn and  Twitter to learn more.

Association Contacts

Monica Hung/SEMI Taiwan
Phone: +886.3.560.1777 ext. 207
Email: 
mhung@semi.org

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: mhall@semi.org

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