TOKYO – October 11, 2022 – With Japan accounting for more than 30% of semiconductor manufacturing equipment and materials sales worldwide, the stage is set for SEMICON Japan 2022 as Japanese and international companies from across the microelectronics manufacturing supply chain gather December 14-16 at Tokyo Big Sight for insights into the latest technology innovations, developments and trends. Industry experts and visionaries will discuss pressing semiconductor industry topics including smart sensing, mobility, flexible hybrid electronics, advanced packaging and materials, and quantum computing. Registration is open.

The new Advanced Packaging and Chiplet Summit (APCS) at SEMICON Japan will bring together industry leaders including AMD, ASE Group, Intel and NTT to discuss packaging innovations that are enabling more compact devices with lower power requirements, higher speeds and greater reliability – key in segments such as artificial intelligence (AI), 5G, and automotive. The Summit will also feature an exhibition and networking event. 

Industry Visionaries Presenting at SEMICON Japan 2022

SEMICON Japan 2022 to Spotlight Innovations Driving Semiconductor Industry Growth

	Dario Gil, Senior Vice President and Director, IBM Research  Opening Keynote Panel
	Tetsuro Higashi, Chairperson of the Executive Board, TIA; Chairman, Councils and Study Groups for Semiconductor and Device Industry Strategy  Opening Keynote Panel
	Ravi Mahajan, Fellow, Intel Advanced Packaging and Chiplet Summit
	Jun Sawada, Chairman, Representative Member of the Board, NTT Keynote
	Chidi Chidambaram, Vice President of Engineering, Qualcomm  Keynote
	Terushi Shimizu, Senior Executive Vice President, Sony Group Corporation; Representative Director, President and CEO,  Sony Semiconductor Solutions  Grand Finale Panel