SEMI 3D & Systems Summit to Spotlight Trends in High-Performance, Energy-Efficient Applications

DRESDEN, Germany — May 16, 2022 — Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 14-15 June, 2022, in Dresden for insights into the latest heterogenous integration innovations enabling the future of intelligent systems for semiconductor manufacturing and applications. Registration is open.

3D
                                  logo

“We look forward to bringing together industry leaders for their perspectives on near-term 3D roadmaps and how the semiconductor industry can enable innovation for emerging applications,” said Laith Altimime, president of SEMI Europe. “Their insights promise to help the semiconductor industry address  new technology challenges and requirements across the entire supply chain.”

Themed Enabling Low-Energy and High-Performance Applications, SEMI 3D & Systems Summit returns to Dresden with a broader scope of topics including: 

  • A Diverse and Sustainable Workforce Enabling Next- Generation Innovation
  • Status of High-End Performance Packaging (2.5D & 3D) - Technology and Market Trends
  • Updates from the 2021 Technology Showcase Winner: Transient Liquid Phase Sintering (Tlps) - Assembly for Heterogeneous Integration
  • Wafer Bonding and New Bonding Technologies
  • Heterogeneous Integration: from Design to Substrates and Technology Development
  • Testing Challenges, Inspection and Metrology
  • Optical Chips Packaging and Co-Packaging
  • Equipment and Materials for 3D Integration
  • High-Performance Computing and Artificial Intelligence

3D & Systems Summit Keynotes

Image
Yvonne Keil, Director Global Indirect Procurement, GlobalFoundries
GlobalFoundries - timely
                                    rebranding and new perspectives
Image
                                    preview
E. Jan Vardaman, President,
TechSearch International, Inc.
TechSearch International
                                    Explores Power Device Packaging and
                                    Assembly Trends - 3D InCites


Global Leaders to Present

3D & Systems Summit presenters include experts from global leaders such as AT&S, Atotech, Besi, CEA-Leti, DeepXscan, ETH Zurich, EV Group (EVG), Evatec AG, Fraunhofer IZM, GlobalFoundries, imec, Intel Deutschland GmbH, KLA, Merck Group, NanoWired GmbH, Siemens EDA, SENTECH, Sipearl, SPTS Technologies, SÜSS MicroTec, TechSearch, and Yole Développement.Exhibition and Networking

The most prominent names in 3D integration microelectronics manufacturing will showcase their latest products and technologies at the exhibition area, including: AEMtec, BESI, Confovis, Evatec, EV Group, FormFactor FRT Metrology, Fraunhofer IZM-ASSID, HEIDENHAIN, Koh Young Europe GmbH, LPKF Laser & Electronics AG, OPTIM Wafer Services, Polyteknik AS and RENA.

The summit will also feature business-to-business matchmaking and networking for participants to explore new partnerships and other business opportunities.

To reserve an exhibition space, contact Adi Hodorov at ahodorov@semi.org and euevents@semi.org.

For more details, please visit the 3D & Systems Summit website and connect with SEMI Europe on   Twitter or  LinkedIn – @SEMIEurope, #3DSummit.

Premium Sponsors     


1 | 2  Next Page »
Featured Video
Jobs
Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California
Design Verification Engineer for Blockwork IT at Milpitas, California
GPU Design Verification Engineer for AMD at Santa Clara, California
CAD Engineer for Nvidia at Santa Clara, California
Sr. Silicon Design Engineer for AMD at Santa Clara, California
Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California
Upcoming Events
Phil Kaufman Award Ceremony and Banquet to be held November 6 at Hayes Mansion at Hayes Mansion 200 Edenvale Ave San Jose CA - Nov 6, 2024
SEMICON Europa 2024 at Messe München München Germany - Nov 12 - 15, 2024
DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024
SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise