PICMG releases brand new COM-HPC Carrier Board Design Guide

 

The design guide supplements the COM-HPC specification for high performance compute modules 

Wakefield, MA., USA, January 2022 – PICMG, a leading consortium for developing open embedded computing specifications, announces that the COM-HPC Carrier Board Design Guide is released and freely available on the PICMG website. The 160-page document provides electronics engineers and PCB layout engineers comprehensive information for designing custom system carrier boards for COM-HPC modules. COM-HPC – short for computer-on-module (COM) - high performance computing (HPC) – is a brand new open Computer-on-Module form factor standard that targets extremely high I/O and computer performance levels from high end clients up to the entry server class and even beyond. Standard COM-HPC modules plug into a carrier or baseboard that is typically customized to the application. OEM benefits are fast and cost effective layout with high design security for application specific embedded and edge computing boards on the basis of open standards.

Especially helpful is the detailed discussion of the challenging module to carrier board Ethernet KR and KR4 backplane signaling. To save pins on COM-HPC modules, the sideband signals for the 10G / 25G / 40G / 100G Ethernet KR interfaces are serialized and must then be deserialized on the carrier board. The design guide provides instructions for this in a series of diagrams.

Additionally, the guide provides enhanced schematics and block diagrams for all provided interfaces such as Serial ATA, PCI Express up to Gen 5, USB4, Boot SPI, eSPI, eDP, MIPI-CSI, SoundWire, asynchronous serial port interfaces, I2C/I3C, GPIO, System Management Bus (SMBus), thermal protection and module type detection. PCB design rule summaries further enable engineers to efficiently design fully signal compliant COM-HPC carrier boards. Also, a section has been added to discuss mechanical considerations including heat spreader/module attachment, alternative board stack assemblies and board stiffeners for carrier boards. Information about all COM-HPC interfaces and a list of useful books to facilitate carrier board designs complete PICMG’s COM-HPC Carrier Board Design Guide.

Electronic design engineers and printed circuit board developers shall note that while the design guide contains additional detailed information it does not replace the PICMG COM-HPC specification. For complete guidelines on the design of COM-HPC compliant carrier boards and systems, it is necessary to refer to the full specification – the design guide is not intended to be the only source for any design decisions. Besides consulting the latest COM-HPC specification, it is also strongly recommended to use the module vendors' product manuals as a reference. The design guide and base specification are accompanied by a Platform Management Interface Specification, and the COMâ�‘HPC EEEP. The existing Embedded API (eAPI) specification also applies to COM-HPC.

Christian Eder, chairman of the COM-HPC committee, said, "This comprehensive document will further accelerate the fast start of the COM-HPC standard. While the specification documents in themselves are already of great use for developers, the detailed Carrier Board Design Guide helps to avoid design problems, especially when handling high-speed signals, such as PCIe Gen 5 and USB4. I expect to see further time-to-market improvements for COM-HPC-based solutions."

PICMG thanks all members of the PICMG COM-HPC committee who have worked on these documents. Special thanks go to Christian Eder, Stefan Milnor and Dylan Lang. Christian Eder, marketing director at congatec, acted as the chairman of the COM-HPC committee. He was previously a draft editor of the current COM Express standard. Stefan Milnor from Kontron and Dylan Lang from Samtec supported Christian Eder in their respective functions as editor and secretary of the PICMG COM-HPC committee.

The COM-HPC Carrier Board Design Guide is available for download at: https://www.picmg.org/wp-content/uploads/PICMG_COMHPC_CDG_R2_0.pdf

The COM-HPC specification as well as additional resources to learn more about COM-HPC can be found at the PICMG website https://www.picmg.org/openstandards/com-hpc/.

~~~~~

About PICMG

Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high performance industrial, Industrial IoT, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are over 130 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, high-speed signaling design and analysis, networking expertise, backplane, and packaging design, power management, high availability software and comprehensive system management.

Key standards families developed by PICMG include COM-HPC, COM Express, CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, SHB Express, MicroSAM, and HPM (Hardware Platform Management). https://www.picmg.org

 

Reader enquiries: Press contact:
PICMG SAMS Network
Jessica Isquith, President Michael Hennen
Christian Eder, Chairman
COM-HPC Technical Committee
Phone: +49-2405-4526720
info@picmg.org
www.picmg.org
info@sams-network.com
www.sams-network.com
Featured Video
Jobs
Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California
Design Verification Engineer for Blockwork IT at Milpitas, California
GPU Design Verification Engineer for AMD at Santa Clara, California
CAD Engineer for Nvidia at Santa Clara, California
Sr. Silicon Design Engineer for AMD at Santa Clara, California
Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California
Upcoming Events
Phil Kaufman Award Ceremony and Banquet to be held November 6 at Hayes Mansion at Hayes Mansion 200 Edenvale Ave San Jose CA - Nov 6, 2024
SEMICON Europa 2024 at Messe München München Germany - Nov 12 - 15, 2024
DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024
SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise