Heterogeneous Integration Chip-let System Package Alliance Established to Expand Market Opportunities

HSINCHU, Dec. 27, 2021 — (PRNewswire) — The development of AI and 5G has boosted the demand for high-end semiconductor chips. In order to enhance critical capabilities of Taiwan's chip industry for this emerging market, the Department of Industrial Technology (DoIT), Ministry of Economic Affairs (MOEA), Taiwan, has supported ITRI to establish the Heterogeneous Integration Chip-let System Package Alliance (Hi-CHIP). This alliance will help create a complete ecosystem covering package design, testing and verification, and pilot production, which will achieve the goal of supply chain localization and expand business opportunities.

ITRI joins hands with semiconductor industry players to form the Hi-CHIP alliance and helps them master key technology capabilities.

 

According to DoIT, the global semiconductor industry is keen to develop heterogeneous chip integration processes, yet there is no effective solution to realize the high-mix low-volume manufacturing required. The Hi-CHIP alliance will provide a trial production platform to assist relevant industry players in accelerating time-to-market.

Dr. Chih-I Wu, Vice President and General Director of the Electronic and Optoelectronic System Research Laboratories at ITRI and Chairman of Hi-CHIP, pointed out that to meet the demand for integrating multiple chips onto a miniaturized system-in-package that enhances functionality, a chiplet-based approach can be adopted to solve challenges such as heat dissipation and signal cascading while reducing costs. He emphasized that multi-dimensional chip designs and heterogeneous packaging integration will be the key to the development of semiconductor industry.

"With the support of DoIT, ITRI has started early to develop advanced packaging technology as well as material and equipment upgrades for heterogeneous integration. The new alliance will provide an AIoT system application platform and one-stop services," said Dr. Wu. He notes that with the process and testing equipment in place, the industry will scale up its production capacity and enable supply chain localization. Hi-CHIP will also work with international alliances such as AITA and CHIPS to jointly promote the growth of the semiconductor industry.

Members of Hi-CHIP currently include semiconductor heavyweights in Taiwan. It is hoped that the alliance will join hands with supply chain players to create custom orders and strengthen core process capabilities, gaining a cutting-edge in the competitive market.

About ITRI

Industrial Technology Research Institute (ITRI) is one of the world's leading technology R&D institutions aiming to innovate a better future for society. Founded in 1973, ITRI has played a vital role in transforming Taiwan's industries from labor-intensive into innovation-driven. To address market needs and global trends, it has launched its 2030 Technology Strategy & Roadmap and focuses on innovation development in Smart Living, Quality Health, and Sustainable Environment. It also strives to strengthen Intelligentization Enabling Technology to support diversified applications.

Over the years, ITRI has been dedicated to incubating startups and spinoffs, including well-known names such as UMC and TSMC. In addition to its headquarters in Taiwan, ITRI has branch offices in the U.S., Europe, and Japan in an effort to extend its R&D scope and promote international cooperation across the globe. For more information, please visit https://www.itri.org/eng.

Cision View original content to download multimedia: https://www.prnewswire.com/news-releases/heterogeneous-integration-chip-let-system-package-alliance-established-to-expand-market-opportunities-301451118.html

SOURCE Industrial Technology Research Institute

Contact:
Company Name: Industrial Technology Research Institute
Vivian Chen, Office of Marketing Communications, ITRI
Phone: +886-3-591-9154
Email Contact

Featured Video
Jobs
Design Verification Engineer for Blockwork IT at Milpitas, California
CAD Engineer for Nvidia at Santa Clara, California
GPU Design Verification Engineer for AMD at Santa Clara, California
Sr. Silicon Design Engineer for AMD at Santa Clara, California
Upcoming Events
Phil Kaufman Award Ceremony and Banquet to be held November 6 at Hayes Mansion at Hayes Mansion 200 Edenvale Ave San Jose CA - Nov 6, 2024
SEMICON Europa 2024 at Messe München München Germany - Nov 12 - 15, 2024
DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024
SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise