AUSTIN, Texas — (BUSINESS WIRE) — July 6, 2021 — The growing impact and productivity gains of designing semiconductors in the cloud comprise the focus the Si2 Annual Technology Forum, an online event scheduled for Friday, August 6, from 8:00 a.m. - to 10:00 a.m. Pacific Standard Time.
Registration is free. For details click here.
Silicon Integration Initiative is an R&D joint venture providing standard interoperability solutions for semiconductor design tools. Si2’s key programs include OpenAccess, a standard application programming interface and reference source code for the design database used by all major chip design software suppliers, and the Compact Model Coalition, which selects and supports industry-standard SPICE simulation models.
AGENDA
Keynote Presentation: Silicon-to-System – Addressing Design, Verification, and Implementation Challenges with Cloud-Based Engineering
David Pellerin
Head of Worldwide Business Development
Hitech/Semiconductor
Amazon Web Services
Executive Panel Discussion: EDA-in-the-Cloud Challenges are Already Solved by Providers
Kerim Kalafala
Senior Technical Staff Member
IBM
Ramond Rodriguez
Senior Director of Strategic CAD Capabilities
Intel
Dr. Rhett Davis
Professor of Computer and Electrical Engineering
NC State University
Rajeev Jain
Senior Director of Technology
Qualcomm
Si2 Technical Coalition Updates
OpenAccess, oaScript Extensions
Marshall Tiner
Si2 Director of Production Standards
Standard Compact Models
John Ellis
Si2 President and CEO
AI/ML, Unified Power Models
Dr. Leigh Anne Clevenger
Si2 Director of OpenStandards
Special Announcement
Learn about a new Si2 industry initiative focusing on silicon-to-system design interoperability
Vic Kulkarni
Si2 Chief Strategy Officer
Annual Power of Partnerships Award
Presented to the Si2 team that has made the most significant contributions to the field of electronic design automation
View source version on businesswire.com: https://www.businesswire.com/news/home/20210706005130/en/
Contact:
Terry Berke
tberke@si2.org
512-917-1358
