Newly Resurrected TD72403L FIFO Memory Chip Enables Vital Defense Platform Extensions

First-In First-Out Semiconductor Device Solves Supply Shortage for Electronic Warfare and Other Key Systems

MILPITAS, Calif. — (BUSINESS WIRE) — March 17, 2021Teledyne e2v HiRel Electronics announces the availability of the newly resurrected TD72403L dual port First-In, First-Out (FIFO) memory device, with Military MlL-PRF-38535, Class Level B processing and a military-suitable temperature range of –55°C to +125°C. It is suitable for platforms using the 5962-89523 Standard Microcircuit Drawing (SMD) for high reliability applications.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210317005181/en/

Teledyne e2v HiRel TD72403 FIFO (Photo: Business Wire)

Teledyne e2v HiRel TD72403 FIFO (Photo: Business Wire)

“Our customers have struggled to find important semiconductor parts that are needed to keep our countries safe,” said Mont Taylor, VP of Business Development for Teledyne e2v HiRel. “The TD72403L joins a long list of combat-proven memory, logic, analog and control devices that we have re-engineered for customers to assure supply availability long into the future.”

The TD72403L has the following features:

  • First-ln/First-Out dual-port memory
  • 64 x 4 organization
  • RAM-based FIFO with low falI-through time
  • Low-power consumption — Active: 175 mW (typical)
  • Maximum shift frequency — 10 MHz
  • Military MlL-PRF-38535, Class Level B processing
  • Military temperature range (–55 °C to +125 °C)

The FIFO device is commonly used for inter-chip communications protocol, frequency matching, bus-width matching, data buffering and data rate matching applications.

Other examples of devices that Teledyne HiRel has re-introduced following re-engineering effort to support legacy systems include:

  • 87C5x 8-bit microcontroller with on-chip user-programmable EPROM memory
  • 741 general purpose operational amplifier
  • AC/ACT logic family multi-project wafer family yielding various advanced CMOS functions
  • 26LS3x quad line driver/receiver family

The new TD72403L FIFO is now available for ordering and immediate purchase.

About Teledyne e2v HiRel Electronics, Inc.

Teledyne e2v HiRel Electronics innovations lead developments in space, transportation, defense, and industrial markets. Teledyne HiRel’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully-custom solutions, bringing increased value to their systems. For more information, visit www.tdehirel.com.



Contact:

Sharon Fletcher
Teledyne Defense Electronics
(323) 241-1623 sharon.fletcher@teledyne.com

Featured Video
Editorial
More Editorial  
Jobs
Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California
Design Verification Engineer for Blockwork IT at Milpitas, California
GPU Design Verification Engineer for AMD at Santa Clara, California
Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California
CAD Engineer for Nvidia at Santa Clara, California
Upcoming Events
MEMS & Sensors Executive Congress (MSEC 2024) at Château-Bromont Hotel in Bromont Quebec Canada - Oct 7 - 9, 2024
PCB West 2024 at Santa Clara Convention Center Santa Clara CA - Oct 8 - 11, 2024
DVcon Europe 2024 at Holiday Inn Munich City Center, Munich Germany - Oct 15 - 16, 2024
International Test Conference (ITC) at United States - Nov 3 - 8, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise