Teledyne e2v expands its Emerald image sensor family with new 36 Mpixel high-speed chip

GRENOBLE, France, Jan. 14, 2020 (GLOBE NEWSWIRE) -- Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its new Emerald 36M, a 37.7 Megapixel image sensor specifically designed for demanding industrial and outdoor applications requiring both high resolution and high speed.

Emerald 36M uniquely combines 6k square resolution and superior frame rate, providing low noise, high quantum efficiency and wide angular response. It also offers excellent image quality that benefits the most challenging applications. The sensor is available in an ultra-high speed and a high-speed version, respectively providing 86fps and 43fps at full resolution.

The sensor is designed to provide easy integration and compatibility with cost-effective FPGAs. It comes in a ceramic µPGA package fitting standard Four Thirds optics, making it the world’s highest resolution global shutter sensor to fit these compact lenses. In addition, Emerald 36M is pin-to-pin and optically compatible with Emerald 67M, so that multiple resolutions and speed grades are possible from a single camera design.

Marie-Charlotte Leclerc, Marketing Manager at Teledyne e2v, said, “We are delighted to release the Emerald 36M. The sensor is already gathering interest from vision system designers looking forward to improved accuracy and throughput with optimized inspection system paths. And beyond the factory floor, Emerald 36M enables surveillance over wider fields of view and provides higher autonomy for aerial mapping and security solutions.”

Evaluation kits and samples of Emerald 36M are available now.

Please visit the product page or contact us for more information.

For media enquiries, please contact:
Jessica.Broom@teledyne.com | + 44 (0)1245 453607

Notes to Editors:

Teledyne e2v is part of the Teledyne Imaging Group. Their innovations lead developments in healthcare, life sciences, space, transportation, defence and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully-custom imaging solutions, bringing increased value to their systems.

For more information, visit imaging.teledyne-e2v.com

Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne Technologies [TDY] umbrella.  Teledyne Imaging forms an unrivalled collective of expertise across the spectrum with decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.

For more information, visit  www.teledyneimaging.com

A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/bc46174d-49f5-4b9e-b1af-ec5cf8700046

Primary Logo

 
Emerald 36M image sensor

 

Teledyne e2v’s Emerald 36M image sensor combines 6k square resolution and superior frame rate
Featured Video
Jobs
CAD Engineer for Nvidia at Santa Clara, California
Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California
Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California
Sr. Silicon Design Engineer for AMD at Santa Clara, California
Design Verification Engineer for Blockwork IT at Milpitas, California
GPU Design Verification Engineer for AMD at Santa Clara, California
Upcoming Events
Phil Kaufman Award Ceremony and Banquet to be held November 6 at Hayes Mansion at Hayes Mansion 200 Edenvale Ave San Jose CA - Nov 6, 2024
SEMICON Europa 2024 at Messe München München Germany - Nov 12 - 15, 2024
DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024
SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise