Media Alert: Rambus to Showcase High-speed IP Cores at the TSMC Technology Symposium in Santa Clara

SUNNYVALE, Calif. & SANTA CLARA, Calif. — (BUSINESS WIRE) — April 23, 2019 — Rambus Inc. (Nasdaq: RMBS):

 

What:

 

TSMC 2019 Technology Symposium

 

Who:

Rambus Inc. (Nasdaq: RMBS), a leader in digital security, semiconductor and IP products and services

 
Where: Rambus at the TSMC Technology Symposium Booth #916
Santa Clara Convention Center
5001 Great America Parkway
Santa Clara, CA 95054
 
When: April 23, 2019. The Symposium will be open from 8:30 a.m. until 6:00 p.m. PT.
 

Today at the 25th annual TSMC Technology Symposium Booth #916 in Santa Clara, Rambus will exhibit its leading-edge GDDR6 technology enabling high-performance applications such as artificial intelligence (AI), machine learning (ML), advanced driver assistance systems (ADAS), data center and networking.

Rambus will also highlight its multi-protocol SerDes technology, including 112G long reach (LR) for next-generation terabit switches, routers, optical transport networks (OTNs) and high-performance networking equipment. 112G is a key building block necessary to support the ever-growing demand for bandwidth in data center and network applications. It doubles the data rate of today’s 56G SerDes. Rambus is at the forefront of implementing 112G on a leading-edge 7nm process node to address requirements for next-generation data-intensive applications. Its 112G SerDes PHY will deliver the optimal combination of power efficiency, performance and area (PPA).

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