New IP Packager Tool Allows Developers to Package and Distribute Soft IP
HILLSBORO, Ore. — (BUSINESS WIRE) — April 22, 2019 — Lattice Semiconductor Corporation (NASDAQ: LSCC), a leading provider of customizable smart connectivity solutions, today announced the release of Lattice Radiant™ Software 1.1, a full featured FPGA design suite with leading-edge design and implementation tools optimized for Lattice’s iCE40 UltraPlus™ family, the industry’s smallest sized and lowest power FPGAs. This new release adds an Intellectual Property (IP) packaging capability that enables external IP developers, including third party IP providers and customers, to prepare and package encrypted IP in the Radiant Software IP format.
Radiant Software 1.1 utilizes a unified design database to implement data convergence and supports the Synopsys Design Constraint (SDC) industry standard to provide maximum interoperability, rapid design exploration, and an easy to use interface. The new Radiant Software 1.1 IP packager tool reduces time to market by allowing developers to use Lattice and non-Lattice IPs in their designs. Furthermore, the IP catalog has also been expanded to include a significant number of modules and parameterized module instantiation (PMI) optimized for iCE40 UltraPlus FPGAs to help designers increase their productivity.
In addition to supporting Windows, Radiant Software 1.1 adds support for the popular Ubuntu LTS 16.4 distribution of Linux. Radiant Software 1.1 is now available for download from Lattice’s website and currently can be used with a free license.
About Lattice Semiconductor
Lattice Semiconductor (NASDAQ: LSCC) is a leader in low power, small form factor programmable logic devices. Our FPGAs deliver intelligence, connectivity, and control solutions to the industrial, compute, communications, consumer, and automotive markets. Our unwavering commitment to our global customers enables them to accelerate their innovation, creating an even better and more connected world.
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