Arteris IP FlexNoC Interconnect & Resilience Package Licensed by Vayyar Imaging for ISO 26262-Compliant 3D Imaging Chips for Automotive Systems

NoC interconnect enables high bandwidth and low latency on-chip communications while increasing functional safety diagnostics coverage

CAMPBELL, Calif. — March 19, 2019 — Arteris IP, the leading supplier of innovative, silicon-proven  network-on-chip (NoC) interconnect intellectual property, today announced that  Vayyar Imaging has licensed  Arteris FlexNoC interconnect IP and the accompanying  FlexNoC Resilience Package for use in its next-generation radio frequency (RF) 3D imaging chips for automotive systems.

"Vayyar’s chip is the most advanced radar imaging SoC in the market today enabling real-time high-resolution 3D Point Cloud. Our chip requires the ability to transfer large amounts of data and make sure the highest safety standards are kept. Arteris NoC technology enables data protection mechanisms that increase the functional safety of our systems to meet the highest automotive safety standards.”

Vayyar creates powerful and unique chips that perform high-resolution 3D imaging in real time using advanced RF technology. The company’s current generation of chips covers multiple radar bands from 3 to 81 GHz and implements 72 transmitters and 72 receivers along with an integral advanced digital signal processor (DSP). Use of the Arteris FlexNoC interconnect IP and Resilience Package will enable the integration of even more processing units while providing in-hardware data protection for automotive functional safety.

“Vayyar’s chip is the most advanced radar imaging SoC in the market today enabling real-time high-resolution 3D Point Cloud. Our chip requires the ability to transfer large amounts of data and make sure the highest safety standards are kept. Arteris NoC technology enables data protection mechanisms that increase the functional safety of our systems to meet the highest automotive safety standards,” said Raviv Melamed, CEO and Co-Founder of Vayyar.

“We are excited that Vayyar, the industry leader in RF 3D imaging technology, has adopted Arteris IP interconnect technology as the communications backbone of their ISO 26262-compliant 3D radar imaging chips,” said K. Charles Janac, President and CEO of Arteris IP. “Vayyar’s choice is confirmation of our technology’s ability to optimize high bandwidth and low latency on-chip communications while increasing system-wide functional safety diagnostic coverage.”

About Vayyar Imaging

Vayyar Imaging is the global leader for imaging and sensing applications with its cutting-edge 3D imaging sensor technology. Vayyar's sensors quickly and easily look into objects or any defined volume and detect even the slightest anomalies and movements to bring highly sophisticated imaging capabilities to many industries. Utilizing a state-of-the-art embedded chip and advanced imaging algorithms, Vayyar’s mission is to help people worldwide improve their health, safety and quality of life using mobile, low-cost, and safe 3D imaging sensors. Visit  www.vayyar.com to learn more.

About Arteris IP

Arteris IP provides  network-on-chip (NoC) interconnect IP to accelerate system-on-chip (SoC) semiconductor assembly for a wide range of applications from AI to automobiles, mobile phones, IoT, cameras, SSD controllers, and servers for customers such as  BaiduMobileyeSamsungHuawei / HiSiliconToshiba and  NXP. Arteris IP products include the  Ncore cache coherent and  FlexNoC non-coherent interconnect IP, the  CodaCache standalone last level cache, and optional  Resilience Package (ISO 26262 functional safety)FlexNoC AI Package, and  PIANO automated timing closure capabilities. Customer results obtained by using Arteris IP products include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. For more information, visit  www.arteris.com.



Contact:

Kurt Shuler
Arteris IP
+1 408 470 7300
Email Contact

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