Intrinsyc Announces Immediate Availability of Premium-Tier

Intrinsyc Announces Immediate Availability of Premium-Tier System on Module based on Qualcomm Technologies’ SDA835

VANCOUVER, British Columbia, Feb. 21, 2019 (GLOBE NEWSWIRE) -- Intrinsyc Technologies Corporation (TSX: ITC and OTCQX: ISYRF) (“Intrinsyc” or the “Company”), a leading provider of solutions for the development and production of embedded and Internet of Things (IoT) products, today announced the availability of the Open-Q™ 835 µSOM (micro System on Module) and Development Kit.

Intrinsyc’s Open-Q™ 835 µSOM is an ultra-compact (50mm x 25mm) production-ready embedded computing module that is ideal for powering premium performance IoT devices. It is powered by the Qualcomm® SDA835 system on chip (SoC) from Qualcomm Technologies, Inc.

“Intrinsyc’s Open-Q™ 835 µSOM is Intrinsyc’s most advanced embedded computing module; enabling the highest combination of computing performance, thermal efficiency and power optimization,” said Cliff Morton, Vice President, Solutions Engineering, Intrinsyc. “Next-generation premium-tier IoT devices, like VR/AR head-mounted displays, IP cameras, enterprise tablets, medical imaging systems, and other devices will benefit from this high-performance production-ready computing module.”

“We are happy to see Intrinsyc’s new micro-SOM product powered by Qualcomm Technologies’ SDA835,” said Jeffery Torrance, vice president, business development, Qualcomm Technologies, Inc. “Qualcomm Technologies is driving the Internet of Things forward with offering the best possible connectivity solutions, and we are proud to enable a bright future of IoT devices along with Intrinsyc.”

Open-Q™ 835 µSOM Specifications:

Qualcomm® Snapdragon™ 835 (APQ8098) Mobile Platform SoC Processors:
- Qualcomm® Kryo™ 280 Octa-core 64-bit ARM v8 compliant CPU
- Qualcomm® Adreno™ 540 GPU
- Qualcomm® Hexagon™ DSP with Hexagon Vector extensions
System Memory: 4GB LPDDR4x RAM (POP) + 32GB UFS flash storage
Wireless Connectivity: Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz 2x2 MU-MIMO + Bluetooth 5.x
Display Interfaces:
- HDMI 2.0a – 4K UHD at 60fps
- VESA DSC 1.1 DisplayPort via USB Type-C
- 2x MIPI 4-lane DSI + touch panel
Camera Interfaces:
- 3x MIPI CSI camera ports
- Dual 14-bit Qualcomm® Spectra™ 180 ISP – up to 32MP single or 16MP dual cameras
Video Performance:
- Encode: 1080p120/4K30/4x 1080p30: H.264, VP8, HEVC, MPEG-4
- Decode: 1080p240/4K60/8x 1080p30: H.264, VP8, HEVC 8/10-bit, VP9, MPEG-4
- Concurrent: 4K30 decode + 4K30 encode or 4K60 decode + 1080p60 encode
Audio Interfaces:
- SLIMBus to support Qualcomm® WCD9335 audio codec (off-SOM)
- Multi-channel I2S digital audio interface
I/O Interfaces:
- 1x USB 3.1 Type C
- 1x USB 2.0 micro-B (UART Logging)
- 1x SDIO 4-bit interface
- 1x PCIe interface
- Sensor interface - SPI, UART, I2C to sensor DSP core
Power: Integrated battery management on SOM
Size: 25mm x 50mm x 4.5mm
Operating System: Android 8 Oreo™

Additional information is available at:

https://www.intrinsyc.com/computing-platforms/open-q-835-usom/

To help IoT device makers accelerate time to market, Intrinsyc provides the Open-Q™ 835 µSOM Development Kit, as well as turnkey product development services, driver and application software development, technical support, and documentation.

Intrinsyc’s Open-Q 835 µSOM Development Kit is a full-featured development platform including the software tools and accessories required to immediately begin development. The development kit marries the production-ready Open‐Q™ 835 µSOM with a carrier board providing numerous expansion and connectivity options to support the development and testing of a wide variety of peripherals and applications, ensuring the fastest time to market possible. The Development Kit is available for purchase at https://shop.intrinsyc.com/products/open-q-835-usom-development-kit.

Contact Intrinsyc at Email Contact with your product requirements and have one of the Company’s solution architects help plan for your successful product development and launch.

ABOUT INTRINSYC TECHNOLOGIES CORPORATION
Intrinsyc provides comprehensive product development services, as well as the industry’s highest-performance production-ready computing modules, to enable rapid commercialization of embedded and Internet of Things (“IoT”) products. Intrinsyc has successfully delivered over 1,300 client projects including sophisticated consumer and industrial IoT products like: robotics, connected cameras, smart displays, augmented reality, smart buildings, wearables, in-vehicle infotainment, and many others. Intrinsyc’s Open-Q™ System on Modules incorporate the industry’s most advanced Qualcomm® Snapdragon™ processor technology from Qualcomm Technologies, Inc., and help OEMs to rapidly bring industry leading products, with rich functionality and high performance, to market. Intrinsyc is publicly traded (TSX: ITC and OTCQX: ISYRF) and is headquartered in Vancouver, BC, Canada; with additional product development centers in Taipei, Taiwan, and Bangalore, India.

For more information, please contact:
Cliff Morton
Vice President, Client Solutions
Intrinsyc Technologies Corporation
Email: Email Contact
Phone: +1-604-801-6461

Intrinsyc and Open-Q and their respective logos are trademarks, registered and otherwise, of Intrinsyc Technologies Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

Qualcomm, Kryo, Adreno, Hexagon, Quick Charge, and Spectra are trademarks of Qualcomm Incorporated, registered in the United States and other countries.

Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Adreno, Qualcomm Hexagon, Qualcomm Spectra, Qualcomm Artificial Intelligence Engine, Qualcomm Quick Charge and Qualcomm Neural Processing SDK are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Bluetooth is a registered trademark of Bluetooth SIG, Inc. Wi-Fi is a registered trademark of the Wi-Fi Alliance. Other products or brand names may be trademarks or registered trademarks of their respective owners.