Kulicke & Soffa to Participate at IPC APEX EXPO 2019

SINGAPORE — (BUSINESS WIRE) — January 28, 2019 — Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S” or the “Company”), announced today that it will be exhibiting at the IPC APEX EXPO 2019 trade show from January 29 through January 31, 2019.

Kulicke & Soffa will be showcasing its latest, highly-versatile, Electronic Assembly equipment which targets the most demanding, high-mix applications. It offers a Slim-Fit feeder increasing module capacity to 128 8mm feeders. The ergonomically designed feeders deliver improved system-level throughput, higher accuracy and reduced switching costs.

In addition, Kulicke & Soffa will be featuring its Hybrid with Horizontal Wafer Feeder that enables the combination of ultra-high-speed passive and active placement with high-accuracy flip-chip bonding directly from wafer. This solution is ideal for high-volume System-in-Package (SiP), flip-chip, die-attach and wafer-level-package manufacturing with placement accuracy up to 7µm @ 3 sigma.

“The evolution of smaller component placement in modules, substrates and PCB drives the requirement for finer pitch and high accuracy placements. K&S invests continually in feature and product development, delivering leading innovation and solutions directly addressing the critical challenges faced by our customers,” said Chan Pin Chong, Kulicke & Soffa’s Senior Vice President for EA/APMR & Wedge Bonder Business Units.

Customers can view these technical solutions at IPC APEX EXPO 2019 trade show in California, San Diego Convention Center, Booth Number 2949. K&S will also be featuring its iX-302 equipment along with other equipment forming the full SMT industry 4.0 (IPC-HERMES-9852) live production line at the Sails Pavilion, Booth Number 4434.

About Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices. ( www.kns.com)



Contact:

Kulicke & Soffa Industries, Inc.
Marilyn Sim
Public Relations
P: +65-6880-9309
F: +65-6880-9580
Email Contact

Kulicke & Soffa Industries, Inc.
Joseph Elgindy
Investor Relations & Strategic Initiatives
P: +1-215-784-7500
F: +1-215-784-6180
Email Contact

Featured Video
Jobs
Design Verification Engineer for Blockwork IT at Milpitas, California
GPU Design Verification Engineer for AMD at Santa Clara, California
Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California
Sr. Silicon Design Engineer for AMD at Santa Clara, California
CAD Engineer for Nvidia at Santa Clara, California
Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California
Upcoming Events
SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024
PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024
DVCon U.S. 2025 at United States - Feb 24 - 27, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise