TE Connectivity to showcase high-speed Innovations at DesignCon 2019

HARRISBURG, Pennsylvania, Dec. 14, 2018 — (PRNewswire) —  TE Connectivity (TE), a world leader in connectivity and sensors, will showcase a broad range of industry-leading high-speed data communications connectivity solutions in booth 817 at the DesignCon 2019 expo Jan. 30-31 in Santa Clara, California. TE offers a full spectrum of powerful, ultra-compact solutions for optimizing the latest data center innovations, delivering the speed, scalability, space-savings, improved thermals, power and reach needed to be first to market.

TE Connectivity Ltd. Logo.

TE's featured live demos in its booth will include:

  • OSFP, QSFP-DD, QSFP, SFP-DD, high-speed I/O and STRADA Whisper, showcasing solutions for 5G, disaggregation, density, improved channels, thermal management, co-packaging and power delivery.
  • The Sliver Interconnect Family, which has not only received industry recognition, but has been identified as the standard interface and required product performance through several industry groups like COBO, GenZ, EDSFF and Open Compute for current and next-gen server, storage and networking designs.

"Speed, density and high efficiency are all key requirements for new data center designs," said Erin Byrne, vice president and chief technology officer for TE Connectivity's Data and Devices business unit. "At DesignCon, TE will showcase solid engineering of industry-standard interfaces with innovative thermal and power management solutions, meeting the challenges of increasing density and speed in the data center."

Learn more on TE's DesignCon 2019 events page.

ABOUT TE CONNECTIVITY
TE Connectivity Ltd. is a $14 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 80,000 employees, including more than 8,000 engineers, working alongside customers in approximately 140 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat and Twitter.

TE Connectivity, TE, TE connectivity logo, and EVERY CONNECTION COUNTS are trademarks of the TE Connectivity Ltd. family of companies. Other logos, product(s) and/or company names might be trademarks of their respective owners.

 Logo - https://mma.prnewswire.com/media/486363/TE_Connectivity_Logo.jpg  

Contact:
Company Name: TE Connectivity, DesignCon 2019
Lauren Brekosky, TE Connectivity, 717-986-7342
Email Contact
Web: http://www.te.com

Featured Video
Jobs
CAD Engineer for Nvidia at Santa Clara, California
Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California
Sr. Silicon Design Engineer for AMD at Santa Clara, California
Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California
GPU Design Verification Engineer for AMD at Santa Clara, California
Design Verification Engineer for Blockwork IT at Milpitas, California
Upcoming Events
SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024
PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024
DVCon U.S. 2025 at United States - Feb 24 - 27, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise