tec-speed 20.0: Designed for the world's most demanding high frequency PCB applications

December 13, 2018 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, has added four new low passive intermodulation (PIM) antenna-grade laminates to its tec-speed 20.0 ceramic-filled hydrocarbon thermoset material series. These latest additions combine unrivalled high-frequency performance (Dk 3.00-3.48 / Df 0.002-0.0037), superior loss characteristics and the highest reliability with fast availability and efficient delivery through Ventec’s fully controlled and managed global supply chain and technical support-network.

No More Compromises - Performance, Price & Availability

The tec-speed 20.0 series, which is designed for the world's most demanding high frequency Printed Circuit Board applications, has now been extended with four new low PIM antenna-grade laminates: L300, L330, L340 and H348. These ceramic-filled, hydrocarbon thermoset materials offer excellent dimensional stability and uniform mechanical properties that help limit PIM.

Preserving signal integrity up to high-GHz frequencies, dielectric constant (Dk) specifications range from 3.0 to 3.48 at 10GHz and dissipation factor (Df) from 0.0025 to 0.0037 at 10 GHz giving customers a choice of the most effective material for their design. All four new materials offer first-rate processability, unrivalled RF characteristics and excellent thermal conductivity values that are ideally suited to cope with the heat generated by high-power levels. Most notable are the outstanding PIM levels of ≦-160 dBc and UL-V0 Flammability rating for the entire series.

With tec-speed 20.0, Ventec has responded to customer demands for high-performance, reliable and cost-efficient high frequency materials that are supported by a fast and efficient global delivery promise and dependable technical support.

tec-speed 20.0 ceramic-filled hydrocarbon thermoset materials are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, ISO/TS16949 and ISO 9001:2015, and, like all Ventec products, are backed by a fully controlled and managed global supply chain, sales- and technical support-network.

Further information about tec-speed 20.0 is available at www.ventecsolutions.com/tec-speed-20/.

About Ventec International

With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, visit www.venteclaminates.com.



Contact:

Kim Sauer (Mr)
Ventec International Group
Global Marketing Communications
+44 7906 019 022
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