Supports OEMs adopting the new Gen-Z high bandwidth, low latency interconnect protocol standard for handling big data.
|
|||||
NEWARK, Calif., Nov. 14, 2018 (GLOBE NEWSWIRE) -- SMART Modular Technologies, Inc., a subsidiary of SMART Global Holdings, Inc., (NASDAQ: SGH), and a leader in specialty memory, storage and hybrid solutions including memory modules, Flash memory cards and other solid state storage products, today announced its Gen-Z Memory Module (ZMM). SMART’s new ZMM conforms to the SSF-8201 form factor specification which SMART helped standardize through the Gen-Z Consortium. SMART’s ZMM supports the Gen-Z interconnect standard which was developed to enable new solution architectures for delivering high levels of performance (high-bandwidth, low-latency), software efficiency, and power optimizations.
SMART’s ZMM uses a new scalable computing interconnect protocol with high bandwidth and low latency that provides a simplified interface based on memory semantics. It operates at data rates up to 40GB/s and with less than 400ns load-to-use memory capacity of 96GB of DRAM. The Gen-Z protocol is designed to handle advanced workloads, enabling data centric computing with scalable memory pools and resources for real-time analytics and in-memory applications.
SMART is partnering with IntelliProp, Inc., a leader in innovative Intellectual Property (IP) Cores and semiconductors for Data Storage and Memory applications, to develop and bring to market Gen-Z IP and ASIC solutions. IntelliProp’s application-specific standard product (ASSP) is a fabric memory controller code-named Mamba that supports the Gen-Z interconnect protocol and provides connectivity to DRAM devices. The Mamba fabric memory controller further supports byte addressability to DRAM devices. Since Mamba is attached to the Gen-Z fabric vs. the DDR4 memory bus, 2.5-inch, U.2 and AIC form factors are available to achieve connectivity between a multitude of CPU or SoC hosts. The Mamba controller supports up to 384GB of DRAM.
According to analysts at IDC Co., in a white paper written in March 2017, total worldwide data is expected to reach 163ZB by 2025, ten times greater than the amount of data generated today. As a result, "real-time" data analysis will become even more critical for OEMs. The Gen-Z interconnect standard solves the bandwidth and latency bottlenecks associated with existing computer architectures allowing for more advanced topologies including multi-CPU shared composable memory architectures.
SMART's ZMM showcases how the Gen-Z standard is designed to handle advance workloads, enabling data centric computing with scalable memory pools and resources for real-time analytics and in-memory applications. OEMs with plans to launch Gen-Z-enabled high-performance computing systems can use SMART's media storage controller card as a storage device in Gen-Z fabrics.
For more information about SMART’s Gen-Z media controller demonstration card, please visit http://www.smartm.com/gen-z.
SMART’s ZMM will be showcased at the SC18 from November 12-15 at the Kay Bailey Hutchison Convention Center in Dallas. The ZMM can be seen in a live server rack demonstration, created by Gen-Z Consortium members, in the Gen-Z Consortium booth #4145. Stop by to learn more about SMART's support of this new protocol.
Connect with SMART on LinkedIn at http://www.linkedin.com/company/smart-modular-technologies.
About SMART Modular Technologies
SMART Modular Technologies is a global leader in specialty memory, storage and hybrid solutions serving the electronics industry for over 25 years. SMART Modular delivers solutions to a broad customer base, including OEMs in computing, networking, communications, storage, mobile and industrial markets. Focused on providing extensive customer-specific design capabilities, technical support and value-added testing services, SMART collaborates closely with their global OEM customers throughout their design process and across multiple projects to create memory, storage and hybrid solutions for demanding applications with differentiated requirements. Taking innovations from the design stage through manufacturing and supply, SMART Modular has developed a comprehensive product line comprised of DRAM, Flash and hybrid memory technologies across various form factors. SMART Modular is a subsidiary of
SMART Global Holdings, Inc. See
www.smartm.com for more information.
About Gen-Z Consortium
Gen-Z is an open systems interconnect designed to provide memory semantic access to data and devices via direct-attached, switched or fabric topologies. The Gen-Z Consortium is made up of leading computer industry companies dedicated to creating and commercializing a new data access technology. The Consortium’s 12 initial members were; AMD, ARM, Broadcom, Cray, Dell EMC, Hewlett Packard Enterprise, Huawei, IDT, Micron, Samsung, SK Hynix, and Xilinx with that list expanding as reflected on our Member List.
The Gen-Z Consortium strongly believes in developing an open ecosystem where members, the broader industry, and customers can work together to deliver robust, high-quality specifications that meet solution needs. The Gen-Z Consortium will periodically publicly post draft specifications and technical concepts to elicit input from the broader industry and directly from customers. For more information visit www.genzconsortium.org.
About IntelliProp
IntelliProp, Inc. develops ASSP Products, licensable IP cores and highly integrated IP Products for the Data Storage industry. Areas of significant expertise include SATA, SAS, PCIe/NVMe, Gen-Z, NVDIMM and RAID technologies. Headquarters, sales office, and design center are located in Longmont, CO. Please see our internet site:
http://www.intelliprop.com or contact IntelliProp at (303) 774-0535.
SMART Contact:
Arthur Sainio
SMART Modular Technologies
(510) 624-8126
arthur.sainio@smartm.com
Gen-Z Contact:
Rachael Watson
Nereus
(971) 706-1312
rwatson@nereus-worldwide.com
IntelliProp Contact:
Larry Cleland
IntelliProp
(303) 358-8359
190313@email4pr.com
A photo accompanying this announcement is available at http://www.globenewswire.com/NewsRoom/AttachmentNg/15b8c65f-ea93-4cba-a07a-eb2fe9ab1f98
