Arasan Chip Systems a leading provider of mobile storage IP will demonstrate its I3Câ„ Host and Device IP while also participating at the I3Câ„ Interop Workshop at MIPI I3C Interop Workshop at Seoul.
Oct 16, 2018, San Jose, CA: Arasan today announced that it will demonstrate it’s Total IP Solution for MIPI I3Câ„ Specifications with its I3C Host IP, I3C Device IP, I3C software and I3C HDK at the “MIPI I3C Interop Workshop” to be held in Seoul between the dates of Oct 15-19, 2018. The demonstration will be part of Arasan’s booth at the exhibits area. Arasan is also participating at the MIPI I3Câ„ Interop Workshop.
“Furthering compliance, especially with regard to emerging standards like I3C is a priority at Arasan. Our continued participation at the I3Câ„ Interop Workshops, including this one at MIPI DevCon Seoul will further our goal to ensure compliance and interoperability of our products while also enabling standards adoption. ” said Prakash Kamath, CTO at Arasan.
Arasan’s I3C IP Cores and software have been seamlessly integrated with its MIPI CSI IP and D-PHY IP for camera control.
Arasan has been a contributor member of the MIPI Association since 2004 . We announced the Industry’s first I3C Host Controller IP compliant with the I3Câ„ HCIâ„ Specifications Ver 1.0. Arasan today offers the broadest MIPI IP Portfolio with over a billion Arasan MIPI IP based chips in production.
Availability
The Arasan MIPI I3C Host IP, I3C Slave IP, I3C Software and I3C HDK are all available to license immediately.
About Arasan
Arasan Chip Systems is a leading provider of Total IP Solutions for mobile, automobile and Drone SoC’s. Arasan’s high-quality, silicon-proven, Total IP Solutions include digital IP cores, analog PHY interface IP, verification IP, HDK, software and optional customization services for mobile connectivity and storage standards. Arasan’s Total IP products serve system architects and chip design teams in applications that require silicon-proven, validated IP, delivered with the ability to integrate and verify both digital, analog and software components in the shortest possible time with the lowest risk.
