SAN JOSE, Calif., Aug. 14, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the availability of a comprehensive report from the Linley Group that details the company’s 7nm IP portfolio. The Linley Group is an industry-leading source for independent technology analysis of semiconductors for networking, communications, mobile, and data-center applications.
The report examines the application of eSilicon’s recently announced 7nm IP platforms for AI and networking. The methodology to configure custom AI accelerators using the eSilicon neuASIC™ platform is detailed. IP discussed in the report includes 56Gbps SerDes, high-bandwidth memory version 2 (HBM2) PHY, ternary content-addressable memory (TCAM) compilers, as well as networking-optimized I/Os and additional types of memory compilers. eSilicon’s approach to 2.5D integration is also discussed, along with a development timeline for its IP platforms and an assessment of the market.
“We were impressed with the progress eSilicon has made in AI and networking,” said Mike Demler, senior analyst at The Linley Group and a senior editor at Microprocessor Report. “These are highly competitive markets and the company’s 7nm IP platforms should provide real differentiation for its customers.”
The report, entitled “eSilicon 7nm SerDes Hits 56Gbps — NeuASIC Platform Includes AI Accelerators for 2.5D/3D ICs” can be downloaded free of charge from the eSilicon website.
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Silicon
eSilicon is an independent provider of complex FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC+IP synergies include complete 2.5D/HBM2 and TCAM platforms for FinFET technology at 16/14/7nm as well as SerDes, specialized memory compilers and I/O libraries. Supported by patented knowledge base and optimization technology, eSilicon delivers a transparent, collaborative, flexible customer experience to serve the high-bandwidth networking, high-performance computing, artificial intelligence (AI) and 5G infrastructure markets.
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