SAN JOSE, Calif., July 6, 2018 /PRNewswire-PRWeb/ --  NexLogic Technologies, Inc. has announced the completion of its International Standards Organization (ISO) 14644-1 Class 4/10,000 and the equivalent Federal Standard 209E (FS209E) Class 10 clean room as an integral part of its new microelectronics services and manufacturing capability.

NexLogic's wire bonding clean room is designed to meet both Class ISO 4 and Class ISO 3. NexLogic is ISO 3/1,000 certified under each technician's workstation, while the overall clean room is certified as Class ISO 4/10,000.

Wire bonding, flip chip, CoB technologies are increasingly moving into PCB manufacturing. Wire bonding, including wedge and ball bonding, is required at the board level to comply with growing customer demands. Those requirements are for directly connecting unpackaged devices onto a board, regardless whether it's a conventional PCB or small rigid or rigid-flex circuits. Today, smaller PCBs are used for wearable, IoT, and other portable applications serving consumer, mil/aero, industrial, medical electronics, and other newly emerging markets.

Zulki Khan, NexLogic Technologies President and Founder, said, "Months ago, our customers and their growing needs for wiring bonding urged us to start looking into the wire bonding technologies to comply with their requirements. In a short period of time, NexLogic has invested CAPEX including our new clean room to meet those customer demands."

The new clean room at NexLogic is in compliance with Class ISO 4 and FS209E standards. ISO clean room classifications specify the amount of airborne particulate of precise sizes that are found per cubic meter. Class ISO 4/10,000 calls for a per maximum particles/m3 count of 2370 >=0.2 µm. Class ISO 3/1,000 specifies maximum particle count of 237 @ >=0.2 µm.

NexLogic has instituted the accepted ISO auditing methodology by using a particle counter meter to measure daily particle counts. This assures the clean room is maintaining the requirements of both ISO 4/10,000 and ISO 3/1,000 Standards. Thirdly, it maintains positive downstream air pressure, meaning air pressure flowing though HEPA (High Efficiency Particulate Air) air filters that trap minuscule particles. These air filters remove from the air that passes through 99.97% of particles the size greater-than-or-equal-to 0.3 µm.

About NexLogic Technologies, Inc.

1995-2018 23rd anniversary year and selected among the Top 10 EMS Providers in Silicon Valley.

An ISO 9001:2008, ISO 13485 Certified, and RoHS compliant EMS provider.

NexLogic is a leading electronic manufacturing services provider that offers total integrated circuit board solutions. The company was established in 1995 and serves over 200 customers in North America. NexLogic's mission is to be the best electronic manufacturing services (EMS) provider to the markets it serves through high quality and an efficient manufacturing process.

http://www.nexlogic.com

SOURCE NexLogic Technologies, Inc.