Please join Samsung Electronics, Amkor, eSilicon and Northwest Logic as we present a complete implementation platform for deep learning ASICs
San Jose, Calif. — April 3, 2018 — Deep learning applications require extreme performance, low power and high efficiency to effectively process the massive amounts of data used in those applications. Many of these artificial intelligence (AI) related systems cannot be realized without the performance and security provided by an advanced application specific integrated circuit (ASIC).
Please join Samsung Electronics, Amkor Technology, eSilicon Corporation and Northwest Logic as we present a complete ASIC platform for deep learning applications. This platform includes high-bandwidth memory (HBM2), 2.5D system-in-package (SiP) design and implementation, HBM2 controllers, HBM2 PHY and memory IP in 14nm and 7nm FinFET process nodes. This webinar will be moderated by Dan Nenni, CEO and founder of SemiWiki.
Wednesday, May 2, 2018
8:00-9:00 AM and 6:00PM-7:00PM Pacific time
More information
8 AM Registration
6 PM Registration
Agenda
Dan Nenni: Overview of market
Samsung Electronics: HBM2 memory solutions
Amkor: Advanced packaging solutions
eSilicon: ASIC/2.5D design and enabling 7/14nm IP platforms (HBM2 PHY, SerDes, TCAM, custom memories)
Northwest Logic: HBM controller
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI and Foundry. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com
Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operating base includes 10 million square feet of floor space, with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S.
eSilicon is an independent provider of complex FinFET-class ASICs, custom IP and advanced 2.5D packaging solutions. Our ASIC+IP synergies include complete, 2.5D/HBM2 and TCAM platforms for FinFET technology at 16/14/7nm as well as SerDes, specialized memory compilers and I/O libraries. Supported by patented knowledge base and optimization technology, eSilicon delivers a transparent, collaborative, flexible customer experience to serve the high-bandwidth networking, high-performance computing, artificial intelligence (AI) and 5G infrastructure markets.
Northwest Logic, founded in 1995 and located in Beaverton, Oregon, provides high-performance, silicon-proven, easy-to-use IP cores including high-performance PCI Express Solution (PCI Express 4.0/3.0/2.1/1.1 cores, DMA cores and drivers), Memory Interface Solution (HBM2, DDR4/3, LPDDR4), and MIPI Solution (CSI-2, DSI-2, DSI). These solutions support a full range of platforms including ASICs, Structured ASICs and FPGAs.
eSilicon is a registered trademark, and the eSilicon logo and Collaborate. Differentiate. Win. are trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners.
Contacts:
Sally Slemons
eSilicon Corporation
408.635.6409
Email Contact
Susan Cain
Cain Communications
408.393.4794
Email Contact
